JPS5539642A - Method of manufacturing high packing density circuit board - Google Patents

Method of manufacturing high packing density circuit board

Info

Publication number
JPS5539642A
JPS5539642A JP11276578A JP11276578A JPS5539642A JP S5539642 A JPS5539642 A JP S5539642A JP 11276578 A JP11276578 A JP 11276578A JP 11276578 A JP11276578 A JP 11276578A JP S5539642 A JPS5539642 A JP S5539642A
Authority
JP
Japan
Prior art keywords
circuit board
packing density
manufacturing high
high packing
density circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11276578A
Other languages
Japanese (ja)
Inventor
Katsuhiko Yabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP11276578A priority Critical patent/JPS5539642A/en
Publication of JPS5539642A publication Critical patent/JPS5539642A/en
Pending legal-status Critical Current

Links

JP11276578A 1978-09-12 1978-09-12 Method of manufacturing high packing density circuit board Pending JPS5539642A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11276578A JPS5539642A (en) 1978-09-12 1978-09-12 Method of manufacturing high packing density circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11276578A JPS5539642A (en) 1978-09-12 1978-09-12 Method of manufacturing high packing density circuit board

Publications (1)

Publication Number Publication Date
JPS5539642A true JPS5539642A (en) 1980-03-19

Family

ID=14594947

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11276578A Pending JPS5539642A (en) 1978-09-12 1978-09-12 Method of manufacturing high packing density circuit board

Country Status (1)

Country Link
JP (1) JPS5539642A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57129731U (en) * 1981-02-10 1982-08-12
JPH0693569A (en) * 1990-10-17 1994-04-05 Lainiere De Picardie Sa Base material for woven fabric under woven raw fabric or warp knitted raw fabric condition for heat bonding of back fabric
DE102016111752A1 (en) 2015-06-30 2017-01-05 Asmo Co., Ltd. WIPER CONTROL DEVICE

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5155952A (en) * 1974-11-11 1976-05-17 Hitachi Ltd INSATSUHAISENKIBANNO SEIZOHOHO
JPS52126767A (en) * 1976-04-16 1977-10-24 Nichicon Capacitor Ltd Method of printing thick film

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5155952A (en) * 1974-11-11 1976-05-17 Hitachi Ltd INSATSUHAISENKIBANNO SEIZOHOHO
JPS52126767A (en) * 1976-04-16 1977-10-24 Nichicon Capacitor Ltd Method of printing thick film

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57129731U (en) * 1981-02-10 1982-08-12
JPS6026086Y2 (en) * 1981-02-10 1985-08-06 島田商事株式会社 Waist core of pants, etc.
JPH0693569A (en) * 1990-10-17 1994-04-05 Lainiere De Picardie Sa Base material for woven fabric under woven raw fabric or warp knitted raw fabric condition for heat bonding of back fabric
DE102016111752A1 (en) 2015-06-30 2017-01-05 Asmo Co., Ltd. WIPER CONTROL DEVICE

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