JPS55103790A - Method of fabricating copper laminated plate for printed circuit board - Google Patents

Method of fabricating copper laminated plate for printed circuit board

Info

Publication number
JPS55103790A
JPS55103790A JP1155879A JP1155879A JPS55103790A JP S55103790 A JPS55103790 A JP S55103790A JP 1155879 A JP1155879 A JP 1155879A JP 1155879 A JP1155879 A JP 1155879A JP S55103790 A JPS55103790 A JP S55103790A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
laminated plate
copper laminated
fabricating copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1155879A
Other languages
Japanese (ja)
Inventor
Yutaka Itou
Akio Takahashi
Motoyo Wajima
Yasusada Morishita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP1155879A priority Critical patent/JPS55103790A/en
Publication of JPS55103790A publication Critical patent/JPS55103790A/en
Pending legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
JP1155879A 1979-02-02 1979-02-02 Method of fabricating copper laminated plate for printed circuit board Pending JPS55103790A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1155879A JPS55103790A (en) 1979-02-02 1979-02-02 Method of fabricating copper laminated plate for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1155879A JPS55103790A (en) 1979-02-02 1979-02-02 Method of fabricating copper laminated plate for printed circuit board

Publications (1)

Publication Number Publication Date
JPS55103790A true JPS55103790A (en) 1980-08-08

Family

ID=11781260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1155879A Pending JPS55103790A (en) 1979-02-02 1979-02-02 Method of fabricating copper laminated plate for printed circuit board

Country Status (1)

Country Link
JP (1) JPS55103790A (en)

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