JPS5496353A - Frame grid assembly - Google Patents

Frame grid assembly

Info

Publication number
JPS5496353A
JPS5496353A JP15715277A JP15715277A JPS5496353A JP S5496353 A JPS5496353 A JP S5496353A JP 15715277 A JP15715277 A JP 15715277A JP 15715277 A JP15715277 A JP 15715277A JP S5496353 A JPS5496353 A JP S5496353A
Authority
JP
Japan
Prior art keywords
thin wire
solder
circumference
overflow
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15715277A
Other languages
Japanese (ja)
Other versions
JPS5748826B2 (en
Inventor
Yoshihiko Metsugi
Osamu Tsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP15715277A priority Critical patent/JPS5496353A/en
Publication of JPS5496353A publication Critical patent/JPS5496353A/en
Publication of JPS5748826B2 publication Critical patent/JPS5748826B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To prevent the overflow of the solder, the pitch disorder of the thin wire, the disconnection and others by coating the heat-resistant powder to the circumference of the frame to which the metal thin wire is to be adhered in order to from the solder overflow perventing film.
CONSTITUTION: For the fram grid assembly to be used to the electron gun electrode of the industrial-use oscilloscope or the like, tungsten thin wire 2 is stretched out over frame 1 made of molybdenum, and solder bar 3 of the tape-shaped silver or the like is placed at the area 4 to which the metal thin wire is to be adhered. Then the graphite powder featuring the water-soluble and heat-resistant characterisitcs is changed into the water-soluble solution and then coated thin at the circumference of area 4 to form film 5 to prevent overflow of the sloder. In such assembly, no solder overflows at the circumference area 4 owing to existence of film 5 even though solder bar 3 may be fused, and thus the disorder of the thin wire, the defective grid, the disconnection and others can be prevented.
COPYRIGHT: (C)1979,JPO&Japio
JP15715277A 1977-12-26 1977-12-26 Frame grid assembly Granted JPS5496353A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15715277A JPS5496353A (en) 1977-12-26 1977-12-26 Frame grid assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15715277A JPS5496353A (en) 1977-12-26 1977-12-26 Frame grid assembly

Publications (2)

Publication Number Publication Date
JPS5496353A true JPS5496353A (en) 1979-07-30
JPS5748826B2 JPS5748826B2 (en) 1982-10-18

Family

ID=15643305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15715277A Granted JPS5496353A (en) 1977-12-26 1977-12-26 Frame grid assembly

Country Status (1)

Country Link
JP (1) JPS5496353A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49125847A (en) * 1973-04-05 1974-12-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49125847A (en) * 1973-04-05 1974-12-02

Also Published As

Publication number Publication date
JPS5748826B2 (en) 1982-10-18

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