JPS5491595A - Curable composition - Google Patents

Curable composition

Info

Publication number
JPS5491595A
JPS5491595A JP15829477A JP15829477A JPS5491595A JP S5491595 A JPS5491595 A JP S5491595A JP 15829477 A JP15829477 A JP 15829477A JP 15829477 A JP15829477 A JP 15829477A JP S5491595 A JPS5491595 A JP S5491595A
Authority
JP
Japan
Prior art keywords
parts
acid
unsaturated
epoxy
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15829477A
Other languages
Japanese (ja)
Inventor
Takao Matsui
Kazuyoshi Shibagaki
Takashi Yamamura
Mikio Aizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP15829477A priority Critical patent/JPS5491595A/en
Publication of JPS5491595A publication Critical patent/JPS5491595A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: A curable composition capable of giving cured articles having improved flexibility, heat and acid resistance, electrical insulating properties, and adhesiveness, comprising an ester derivative of an α,β-unsaturated acid, a specific epoxy compound, a phosphoric acid (ester), and a polymerization initiator.
CONSTITUTION: (A) 100 parts by wt. of an ester derivative of an α,β-unsaturated acid obtained from a compound having two or more hydroxyl or epoxy groups in the molecule and an α,β-unsaturated acid is incorporated with (B) 0.5W100 parts by wt. of an unsaturated monomer having a diluent action and one or more polymerizable unsaturated bonds capable of addition polymerization with the component (A), (C) 0.5W300 parts by wt. of a liquid epoxy compound having two or more epoxy groups and possibly halogen, and an epoxy equivalent of 100W500, and (D) 0.01W20 parts by wt. of a phosphate and 1or phosphoric acid having no polymerizable unsaturated bond, and (E) 0.05W30 parts by wt. of a photo-setting or hot-curing polymerization initiator.
COPYRIGHT: (C)1979,JPO&Japio
JP15829477A 1977-12-29 1977-12-29 Curable composition Pending JPS5491595A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15829477A JPS5491595A (en) 1977-12-29 1977-12-29 Curable composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15829477A JPS5491595A (en) 1977-12-29 1977-12-29 Curable composition

Publications (1)

Publication Number Publication Date
JPS5491595A true JPS5491595A (en) 1979-07-20

Family

ID=15668454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15829477A Pending JPS5491595A (en) 1977-12-29 1977-12-29 Curable composition

Country Status (1)

Country Link
JP (1) JPS5491595A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4703338A (en) * 1983-10-14 1987-10-27 Daicel Chemical Industries, Ltd. Resin composition to seal electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4703338A (en) * 1983-10-14 1987-10-27 Daicel Chemical Industries, Ltd. Resin composition to seal electronic device

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