JPS5489574A - Device for tightening power semiconductor - Google Patents

Device for tightening power semiconductor

Info

Publication number
JPS5489574A
JPS5489574A JP15566678A JP15566678A JPS5489574A JP S5489574 A JPS5489574 A JP S5489574A JP 15566678 A JP15566678 A JP 15566678A JP 15566678 A JP15566678 A JP 15566678A JP S5489574 A JPS5489574 A JP S5489574A
Authority
JP
Japan
Prior art keywords
power semiconductor
tightening power
tightening
semiconductor
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15566678A
Other languages
Japanese (ja)
Inventor
Imuritsuhi Yohan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS5489574A publication Critical patent/JPS5489574A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
JP15566678A 1977-12-15 1978-12-14 Device for tightening power semiconductor Pending JPS5489574A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772756005 DE2756005A1 (en) 1977-12-15 1977-12-15 Clamping device for power semiconductor and heat sink - has insulated clamping bolts, each coupled to insulator between heat sink plates

Publications (1)

Publication Number Publication Date
JPS5489574A true JPS5489574A (en) 1979-07-16

Family

ID=6026249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15566678A Pending JPS5489574A (en) 1977-12-15 1978-12-14 Device for tightening power semiconductor

Country Status (2)

Country Link
JP (1) JPS5489574A (en)
DE (1) DE2756005A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3910470A1 (en) * 1988-03-31 1989-10-19 Toshiba Kawasaki Kk POWER SEMICONDUCTOR SWITCH DEVICE
JP2011181707A (en) * 2010-03-02 2011-09-15 Mitsubishi Electric Corp High power stack

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57100737A (en) * 1980-12-16 1982-06-23 Toshiba Corp Semiconductor device
DE4025885C2 (en) * 1990-08-16 1994-09-08 Gewerk Auguste Victoria Semiconductor column

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3910470A1 (en) * 1988-03-31 1989-10-19 Toshiba Kawasaki Kk POWER SEMICONDUCTOR SWITCH DEVICE
US5006921A (en) * 1988-03-31 1991-04-09 Kabushiki Kaisha Toshiba Power semiconductor switching apparatus with heat sinks
JP2011181707A (en) * 2010-03-02 2011-09-15 Mitsubishi Electric Corp High power stack

Also Published As

Publication number Publication date
DE2756005A1 (en) 1979-06-21

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