JPS5487075U - - Google Patents
Info
- Publication number
- JPS5487075U JPS5487075U JP1977162452U JP16245277U JPS5487075U JP S5487075 U JPS5487075 U JP S5487075U JP 1977162452 U JP1977162452 U JP 1977162452U JP 16245277 U JP16245277 U JP 16245277U JP S5487075 U JPS5487075 U JP S5487075U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977162452U JPS5487075U (https=) | 1977-11-30 | 1977-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977162452U JPS5487075U (https=) | 1977-11-30 | 1977-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5487075U true JPS5487075U (https=) | 1979-06-20 |
Family
ID=29158184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977162452U Pending JPS5487075U (https=) | 1977-11-30 | 1977-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5487075U (https=) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6321692A (ja) * | 1986-07-15 | 1988-01-29 | アンリツ株式会社 | Ｌｅｄ表示装置とその製造方法 |
| JPH09146479A (ja) * | 1995-11-24 | 1997-06-06 | Toyoda Gosei Co Ltd | 車両用メータ |
| JP2008028005A (ja) * | 2006-07-19 | 2008-02-07 | Avago Technologies Ecbu Ip (Singapore) Pte Ltd | 発光ダイオードモジュール |
| WO2017208606A1 (ja) * | 2016-06-01 | 2017-12-07 | シャープ株式会社 | 光センサおよび電子機器 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52127789A (en) * | 1976-04-19 | 1977-10-26 | Mitsubishi Electric Corp | Semiconductor radiation element device |
-
1977
- 1977-11-30 JP JP1977162452U patent/JPS5487075U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52127789A (en) * | 1976-04-19 | 1977-10-26 | Mitsubishi Electric Corp | Semiconductor radiation element device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6321692A (ja) * | 1986-07-15 | 1988-01-29 | アンリツ株式会社 | Ｌｅｄ表示装置とその製造方法 |
| JPH09146479A (ja) * | 1995-11-24 | 1997-06-06 | Toyoda Gosei Co Ltd | 車両用メータ |
| JP2008028005A (ja) * | 2006-07-19 | 2008-02-07 | Avago Technologies Ecbu Ip (Singapore) Pte Ltd | 発光ダイオードモジュール |
| WO2017208606A1 (ja) * | 2016-06-01 | 2017-12-07 | シャープ株式会社 | 光センサおよび電子機器 |