JPS5487066A - Semiconductor wafer - Google Patents

Semiconductor wafer

Info

Publication number
JPS5487066A
JPS5487066A JP15524577A JP15524577A JPS5487066A JP S5487066 A JPS5487066 A JP S5487066A JP 15524577 A JP15524577 A JP 15524577A JP 15524577 A JP15524577 A JP 15524577A JP S5487066 A JPS5487066 A JP S5487066A
Authority
JP
Japan
Prior art keywords
wafer
distortion
semiconductor wafer
heat
heat treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15524577A
Other languages
English (en)
Inventor
Teruichiro Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15524577A priority Critical patent/JPS5487066A/ja
Publication of JPS5487066A publication Critical patent/JPS5487066A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Bipolar Transistors (AREA)
JP15524577A 1977-12-22 1977-12-22 Semiconductor wafer Pending JPS5487066A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15524577A JPS5487066A (en) 1977-12-22 1977-12-22 Semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15524577A JPS5487066A (en) 1977-12-22 1977-12-22 Semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5487066A true JPS5487066A (en) 1979-07-11

Family

ID=15601695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15524577A Pending JPS5487066A (en) 1977-12-22 1977-12-22 Semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5487066A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54148474A (en) * 1978-05-15 1979-11-20 Nec Corp Manufacture of semiconductor device
JPS5874044A (ja) * 1981-10-29 1983-05-04 Matsushita Electric Ind Co Ltd 半導体基板及びそれを用いた半導体装置の製造方法
JPS61198637A (ja) * 1986-01-24 1986-09-03 Nec Corp 半導体単結晶ウエハ−の製法
JP2007109838A (ja) * 2005-10-13 2007-04-26 Disco Abrasive Syst Ltd デバイスおよびその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54148474A (en) * 1978-05-15 1979-11-20 Nec Corp Manufacture of semiconductor device
JPS5874044A (ja) * 1981-10-29 1983-05-04 Matsushita Electric Ind Co Ltd 半導体基板及びそれを用いた半導体装置の製造方法
JPS61198637A (ja) * 1986-01-24 1986-09-03 Nec Corp 半導体単結晶ウエハ−の製法
JPH0235456B2 (ja) * 1986-01-24 1990-08-10 Nippon Electric Co
JP2007109838A (ja) * 2005-10-13 2007-04-26 Disco Abrasive Syst Ltd デバイスおよびその製造方法

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