JPS548486A - Bidirectional luminous diode - Google Patents

Bidirectional luminous diode

Info

Publication number
JPS548486A
JPS548486A JP7375277A JP7375277A JPS548486A JP S548486 A JPS548486 A JP S548486A JP 7375277 A JP7375277 A JP 7375277A JP 7375277 A JP7375277 A JP 7375277A JP S548486 A JPS548486 A JP S548486A
Authority
JP
Japan
Prior art keywords
bidirectional
luminous diode
luminous
diode
bidirectional luminous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7375277A
Other languages
English (en)
Inventor
Hisashi Araki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP7375277A priority Critical patent/JPS548486A/ja
Publication of JPS548486A publication Critical patent/JPS548486A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Led Device Packages (AREA)
JP7375277A 1977-06-21 1977-06-21 Bidirectional luminous diode Pending JPS548486A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7375277A JPS548486A (en) 1977-06-21 1977-06-21 Bidirectional luminous diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7375277A JPS548486A (en) 1977-06-21 1977-06-21 Bidirectional luminous diode

Publications (1)

Publication Number Publication Date
JPS548486A true JPS548486A (en) 1979-01-22

Family

ID=13527284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7375277A Pending JPS548486A (en) 1977-06-21 1977-06-21 Bidirectional luminous diode

Country Status (1)

Country Link
JP (1) JPS548486A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58186936A (ja) * 1982-04-08 1983-11-01 ウエスタ−ン・エレクトリツク・カムパニ−・インコ−ポレ−テツド デバイスを製造するためのリングラフイ方法
JP2005020038A (ja) * 2004-10-18 2005-01-20 Nichia Chem Ind Ltd 発光ダイオード
JP2009506556A (ja) * 2005-08-30 2009-02-12 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 表面実装可能なオプトエレクトロニクス素子及び表面実装可能なオプトエレクトロニクス素子の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58186936A (ja) * 1982-04-08 1983-11-01 ウエスタ−ン・エレクトリツク・カムパニ−・インコ−ポレ−テツド デバイスを製造するためのリングラフイ方法
JPH0420252B2 (ja) * 1982-04-08 1992-04-02 Ei Teii Ando Teii Tekunorojiizu Inc
JP2005020038A (ja) * 2004-10-18 2005-01-20 Nichia Chem Ind Ltd 発光ダイオード
JP4626258B2 (ja) * 2004-10-18 2011-02-02 日亜化学工業株式会社 発光ダイオード
JP2009506556A (ja) * 2005-08-30 2009-02-12 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 表面実装可能なオプトエレクトロニクス素子及び表面実装可能なオプトエレクトロニクス素子の製造方法

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