JP4626258B2 - 発光ダイオード - Google Patents
発光ダイオード Download PDFInfo
- Publication number
- JP4626258B2 JP4626258B2 JP2004303593A JP2004303593A JP4626258B2 JP 4626258 B2 JP4626258 B2 JP 4626258B2 JP 2004303593 A JP2004303593 A JP 2004303593A JP 2004303593 A JP2004303593 A JP 2004303593A JP 4626258 B2 JP4626258 B2 JP 4626258B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting diode
- voltage
- zener diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- Led Devices (AREA)
- Led Device Packages (AREA)
Description
このような3族窒化物半導体からなる発光ダイオードは、発光素子の構造上、電気的なショックにより素子の破壊が起こりやすい。特に、乾燥した雰囲気、帯電し易い環境で発光ダイオード及び発光ダイオード実装部品を取り扱うと、静電気により発光ダイオードが破壊される場合がある。
さらに、前記樹脂はエポキシ樹脂であってもよい。
22、32、44、53・・・ツェナーダイオードチップ
35、45、54・・・金線
41、51・・・リードフレーム
33・・・ステム
34・・・キャップ
42・・・プラスチックパッケージ
58・・・モールド樹脂
36、47・・・Agペースト
46、56・・・エポキシ樹脂
57・・・溶接による金属片
Claims (3)
- 発光素子と、前記発光素子に対して逆並列に電気接続されるツェナーダイオードチップとを備えた発光ダイオードであって、
先端にカップを有するマウントリードと、インナーリードと、前記発光素子及び前記ツェナーダイオードチップを封止する樹脂と、を有し、
前記発光素子は前記カップに接合されており、
前記ツェナーダイオードチップは同一面側に正負の電極を有し、該正負の電極は、前記インナーリードと前記マウントリードに溶接によりそれぞれ直接接合されていることを特徴とする発光ダイオード。 - 前記発光素子がサファイア基板上に形成されたダブルへテロ構造である請求項1に記載の発光ダイオード。
- 前記樹脂はエポキシ樹脂である請求項1または2に記載の発光ダイオード。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004303593A JP4626258B2 (ja) | 2004-10-18 | 2004-10-18 | 発光ダイオード |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004303593A JP4626258B2 (ja) | 2004-10-18 | 2004-10-18 | 発光ダイオード |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP31936298A Division JP2000150962A (ja) | 1998-11-10 | 1998-11-10 | 発光ダイオード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005020038A JP2005020038A (ja) | 2005-01-20 |
JP4626258B2 true JP4626258B2 (ja) | 2011-02-02 |
Family
ID=34191924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004303593A Expired - Lifetime JP4626258B2 (ja) | 2004-10-18 | 2004-10-18 | 発光ダイオード |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4626258B2 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007004745A1 (en) | 2005-07-05 | 2007-01-11 | Showa Denko K.K. | Light-emitting diode and method for fabrication thereof |
JP4907121B2 (ja) | 2005-07-28 | 2012-03-28 | 昭和電工株式会社 | 発光ダイオード及び発光ダイオードランプ |
JP4890813B2 (ja) | 2005-08-05 | 2012-03-07 | 昭和電工株式会社 | 発光ダイオード及び発光ダイオードランプ |
KR100709787B1 (ko) * | 2005-10-07 | 2007-04-19 | 광전자 주식회사 | 수광소자 및 전기적 기능소자를 포함하는 발광다이오드 |
KR100637476B1 (ko) * | 2005-11-09 | 2006-10-23 | 알티전자 주식회사 | 측면발광 다이오드 및 그 제조방법 |
KR100882822B1 (ko) | 2006-03-31 | 2009-02-10 | 서울반도체 주식회사 | 정전기 방지부를 내장한 발광소자 |
JP4923711B2 (ja) * | 2006-05-02 | 2012-04-25 | 日亜化学工業株式会社 | 発光装置 |
JP5114773B2 (ja) * | 2007-08-10 | 2013-01-09 | スタンレー電気株式会社 | 表面実装型発光装置 |
KR100846973B1 (ko) * | 2007-10-16 | 2008-07-17 | 조정웅 | 발광다이오드 패키지 및 그 제조 방법 |
KR100981214B1 (ko) * | 2008-01-28 | 2010-09-10 | 알티전자 주식회사 | 발광다이오드 패키지 |
JP2013179271A (ja) | 2012-01-31 | 2013-09-09 | Rohm Co Ltd | 発光装置および発光装置の製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51162670U (ja) * | 1975-06-18 | 1976-12-24 | ||
JPS548486A (en) * | 1977-06-21 | 1979-01-22 | Hisashi Araki | Bidirectional luminous diode |
JPH0196737U (ja) * | 1987-12-16 | 1989-06-27 | ||
JPH10200159A (ja) * | 1997-01-10 | 1998-07-31 | Rohm Co Ltd | 半導体発光素子 |
JPH10256610A (ja) * | 1997-01-10 | 1998-09-25 | Rohm Co Ltd | 半導体発光素子 |
JPH1154804A (ja) * | 1997-07-30 | 1999-02-26 | Rohm Co Ltd | チップ型発光素子 |
-
2004
- 2004-10-18 JP JP2004303593A patent/JP4626258B2/ja not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51162670U (ja) * | 1975-06-18 | 1976-12-24 | ||
JPS548486A (en) * | 1977-06-21 | 1979-01-22 | Hisashi Araki | Bidirectional luminous diode |
JPH0196737U (ja) * | 1987-12-16 | 1989-06-27 | ||
JPH10200159A (ja) * | 1997-01-10 | 1998-07-31 | Rohm Co Ltd | 半導体発光素子 |
JPH10256610A (ja) * | 1997-01-10 | 1998-09-25 | Rohm Co Ltd | 半導体発光素子 |
JPH1154804A (ja) * | 1997-07-30 | 1999-02-26 | Rohm Co Ltd | チップ型発光素子 |
Also Published As
Publication number | Publication date |
---|---|
JP2005020038A (ja) | 2005-01-20 |
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