JPS5483634A - Partially plating method - Google Patents

Partially plating method

Info

Publication number
JPS5483634A
JPS5483634A JP15145677A JP15145677A JPS5483634A JP S5483634 A JPS5483634 A JP S5483634A JP 15145677 A JP15145677 A JP 15145677A JP 15145677 A JP15145677 A JP 15145677A JP S5483634 A JPS5483634 A JP S5483634A
Authority
JP
Japan
Prior art keywords
parts
plating
marking
plated
product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15145677A
Other languages
Japanese (ja)
Other versions
JPS6041154B2 (en
Inventor
Mamoru Onda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP52151456A priority Critical patent/JPS6041154B2/en
Publication of JPS5483634A publication Critical patent/JPS5483634A/en
Publication of JPS6041154B2 publication Critical patent/JPS6041154B2/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • C25D5/022Electroplating of selected surface areas using masking means
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C23C2/022Pretreatment of the material to be coated, e.g. for coating on selected surface areas by heating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C23C2/024Pretreatment of the material to be coated, e.g. for coating on selected surface areas by cleaning or etching

Abstract

PURPOSE:To easily carry out cheap partial plating of a product even if the shape of the parts to be plated is complicated, by marking the shape on the product surface by printing, etc.; forming a plating resist film on other parts; removing the marking material; and plating the removed parts. CONSTITUTION:The surface of product 10 to be plated undergoes numerical marking 11 with ink, and plating resist film 12 is formed on other parts. After removing marking 11, predetermined plating 13 is carried out, and finally film 12 is removed. By this method letters, spots, figures, drawings, etc. can be partially plated at a lower cost than that of a photoresist method.
JP52151456A 1977-12-15 1977-12-15 Partial plating method Expired JPS6041154B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52151456A JPS6041154B2 (en) 1977-12-15 1977-12-15 Partial plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52151456A JPS6041154B2 (en) 1977-12-15 1977-12-15 Partial plating method

Publications (2)

Publication Number Publication Date
JPS5483634A true JPS5483634A (en) 1979-07-03
JPS6041154B2 JPS6041154B2 (en) 1985-09-14

Family

ID=15518955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52151456A Expired JPS6041154B2 (en) 1977-12-15 1977-12-15 Partial plating method

Country Status (1)

Country Link
JP (1) JPS6041154B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57101690A (en) * 1980-12-15 1982-06-24 Katsuhiro Okubo Method for masking partial electroplating of metal

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50128636A (en) * 1974-03-29 1975-10-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50128636A (en) * 1974-03-29 1975-10-09

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57101690A (en) * 1980-12-15 1982-06-24 Katsuhiro Okubo Method for masking partial electroplating of metal
JPS5844755B2 (en) * 1980-12-15 1983-10-05 勝弘 大久保 Masking method for partial electroplating of metal

Also Published As

Publication number Publication date
JPS6041154B2 (en) 1985-09-14

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