JPS5483634A - Partially plating method - Google Patents
Partially plating methodInfo
- Publication number
- JPS5483634A JPS5483634A JP15145677A JP15145677A JPS5483634A JP S5483634 A JPS5483634 A JP S5483634A JP 15145677 A JP15145677 A JP 15145677A JP 15145677 A JP15145677 A JP 15145677A JP S5483634 A JPS5483634 A JP S5483634A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- plating
- marking
- plated
- product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title abstract 6
- 238000000034 method Methods 0.000 title abstract 3
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
- C23C2/022—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by heating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
- C23C2/024—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by cleaning or etching
Abstract
PURPOSE:To easily carry out cheap partial plating of a product even if the shape of the parts to be plated is complicated, by marking the shape on the product surface by printing, etc.; forming a plating resist film on other parts; removing the marking material; and plating the removed parts. CONSTITUTION:The surface of product 10 to be plated undergoes numerical marking 11 with ink, and plating resist film 12 is formed on other parts. After removing marking 11, predetermined plating 13 is carried out, and finally film 12 is removed. By this method letters, spots, figures, drawings, etc. can be partially plated at a lower cost than that of a photoresist method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52151456A JPS6041154B2 (en) | 1977-12-15 | 1977-12-15 | Partial plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52151456A JPS6041154B2 (en) | 1977-12-15 | 1977-12-15 | Partial plating method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5483634A true JPS5483634A (en) | 1979-07-03 |
JPS6041154B2 JPS6041154B2 (en) | 1985-09-14 |
Family
ID=15518955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52151456A Expired JPS6041154B2 (en) | 1977-12-15 | 1977-12-15 | Partial plating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6041154B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57101690A (en) * | 1980-12-15 | 1982-06-24 | Katsuhiro Okubo | Method for masking partial electroplating of metal |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50128636A (en) * | 1974-03-29 | 1975-10-09 |
-
1977
- 1977-12-15 JP JP52151456A patent/JPS6041154B2/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50128636A (en) * | 1974-03-29 | 1975-10-09 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57101690A (en) * | 1980-12-15 | 1982-06-24 | Katsuhiro Okubo | Method for masking partial electroplating of metal |
JPS5844755B2 (en) * | 1980-12-15 | 1983-10-05 | 勝弘 大久保 | Masking method for partial electroplating of metal |
Also Published As
Publication number | Publication date |
---|---|
JPS6041154B2 (en) | 1985-09-14 |
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