JPS5472973A - Rotary applying unit - Google Patents

Rotary applying unit

Info

Publication number
JPS5472973A
JPS5472973A JP13997877A JP13997877A JPS5472973A JP S5472973 A JPS5472973 A JP S5472973A JP 13997877 A JP13997877 A JP 13997877A JP 13997877 A JP13997877 A JP 13997877A JP S5472973 A JPS5472973 A JP S5472973A
Authority
JP
Japan
Prior art keywords
wafer
applying unit
container
applied body
sticking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13997877A
Other languages
Japanese (ja)
Inventor
Tamotsu Sasaki
Toshio Nonaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13997877A priority Critical patent/JPS5472973A/en
Publication of JPS5472973A publication Critical patent/JPS5472973A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent flying matter from sticking to an application surface, by providing a bounce preventive board whose diameter is nerly equal to an applied body to a rotary applying unit, which has a coating dropping aperture at the center part of the upper part of the rotating applied body in a plate shape, while covering the applied body.
CONSTITUTION: Rotary axis 3 is made to pierce the applying unit composed of container part 1 and cover part 2, and onto this axis 3, the wafer fixing pedestal on which semiconductor wafer 5 is mouted is fixed. Then, skirt ring 6 is fixed to the flank of container 1 surrounding wafer 5, and the container bottom part is provided with exhaust duct 7. Next, although nozzle 8 dropping a coating material is provided over wafer 5 at an interval, bounce preventive board 9 which is nearly equal in diameter to wafer 5 and has an opening at its center is arranged between nozzle 8 and wafer 5 at an interval of about lcm in parallel to them, by supportt 10 provided to cover 2. consequently, the coating material flying irregularly from skirt ring 6 sticks to preventive board 9, so that its sticking to wafer 5 will be reduced.
COPYRIGHT: (C)1979,JPO&Japio
JP13997877A 1977-11-24 1977-11-24 Rotary applying unit Pending JPS5472973A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13997877A JPS5472973A (en) 1977-11-24 1977-11-24 Rotary applying unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13997877A JPS5472973A (en) 1977-11-24 1977-11-24 Rotary applying unit

Publications (1)

Publication Number Publication Date
JPS5472973A true JPS5472973A (en) 1979-06-11

Family

ID=15258088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13997877A Pending JPS5472973A (en) 1977-11-24 1977-11-24 Rotary applying unit

Country Status (1)

Country Link
JP (1) JPS5472973A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121227A (en) * 1981-01-20 1982-07-28 Toshiba Corp Resist applying device
JPS592134U (en) * 1982-06-28 1984-01-09 株式会社東芝 Rotary coating device
JPS6146028A (en) * 1984-08-10 1986-03-06 Fujitsu Ltd Resist coater
JPS62140674A (en) * 1985-12-12 1987-06-24 Matsushita Electric Ind Co Ltd Resist coater
JPS6470168A (en) * 1987-09-11 1989-03-15 Hitachi Ltd Liquid chemical applicator
JPH01254277A (en) * 1988-03-31 1989-10-11 Matsushita Electric Ind Co Ltd Spinner rotation treatment apparatus

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121227A (en) * 1981-01-20 1982-07-28 Toshiba Corp Resist applying device
JPS6217851B2 (en) * 1981-01-20 1987-04-20 Tokyo Shibaura Electric Co
JPS592134U (en) * 1982-06-28 1984-01-09 株式会社東芝 Rotary coating device
JPS6339966Y2 (en) * 1982-06-28 1988-10-19
JPS6146028A (en) * 1984-08-10 1986-03-06 Fujitsu Ltd Resist coater
JPS62140674A (en) * 1985-12-12 1987-06-24 Matsushita Electric Ind Co Ltd Resist coater
JPS6470168A (en) * 1987-09-11 1989-03-15 Hitachi Ltd Liquid chemical applicator
JPH01254277A (en) * 1988-03-31 1989-10-11 Matsushita Electric Ind Co Ltd Spinner rotation treatment apparatus

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