JPS5467103A - Heat absorbing method and its apparatus - Google Patents

Abstract

PURPOSE: To provide a heat absorbing method by which the radiant heat from a high-temperature heat source is transmitted to the fluid in a pipe effectively, without increasing the fluid resistance in the pipe, and the provide a heat absorbing surface structure.

CONSTITUTION: The radiant heat from a high-temperature heat source 1 passes through the wall 3 of a heat absorbing surface 2 which faces to the high-temperature heat source and evaporates the heat conducting medium 14 as operating liquid which is stored in a storing part 22. The vapour 15 of the heat conducting medium passes through a sealed space 16 and is condensed on the whole surface of the outside wall of the heat conducting pipe 5 which constitutes a cooling path, and transmits heat to the fluid 17 to be heated in the heat conducting pipe. The heat conducting medium 14 having condensed flows down on a partition plate 6 and is stored in the storing part 22 and returns again to the wall 3 of the heat absorbing surface 2 which faces to the high-temperature heat source. In this case, an unit heat absorbing apparatus is constituted of the heat absorbing surface 3, heat conducting medium storing part 22, space 16 for heat conducting medium vapour, and the cooling path 5. Thus, radiant heat can be transmitted effectively to the fluid in the pipe.

COPYRIGHT: (C)1979,JPO&Japio