JPS5458352A - Method of bonding wire - Google Patents

Method of bonding wire

Info

Publication number
JPS5458352A
JPS5458352A JP12447277A JP12447277A JPS5458352A JP S5458352 A JPS5458352 A JP S5458352A JP 12447277 A JP12447277 A JP 12447277A JP 12447277 A JP12447277 A JP 12447277A JP S5458352 A JPS5458352 A JP S5458352A
Authority
JP
Japan
Prior art keywords
bonding wire
bonding
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12447277A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6132814B2 (en:Method
Inventor
Masajirou Takasaki
Kazuhiro Hayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP12447277A priority Critical patent/JPS5458352A/ja
Publication of JPS5458352A publication Critical patent/JPS5458352A/ja
Publication of JPS6132814B2 publication Critical patent/JPS6132814B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/536—
    • H10W72/5363—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP12447277A 1977-10-19 1977-10-19 Method of bonding wire Granted JPS5458352A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12447277A JPS5458352A (en) 1977-10-19 1977-10-19 Method of bonding wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12447277A JPS5458352A (en) 1977-10-19 1977-10-19 Method of bonding wire

Publications (2)

Publication Number Publication Date
JPS5458352A true JPS5458352A (en) 1979-05-11
JPS6132814B2 JPS6132814B2 (en:Method) 1986-07-29

Family

ID=14886352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12447277A Granted JPS5458352A (en) 1977-10-19 1977-10-19 Method of bonding wire

Country Status (1)

Country Link
JP (1) JPS5458352A (en:Method)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58139435A (ja) * 1982-02-15 1983-08-18 Toshiba Corp ボンディング方法
JP2012169309A (ja) * 2011-02-09 2012-09-06 Ricoh Co Ltd 電子装置及びその製造方法並びに画像形成装置
US10181452B2 (en) 2017-01-27 2019-01-15 Nichia Corporation Method for manufacturing light-emitting device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5041818U (en:Method) * 1973-08-13 1975-04-28

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5041818U (en:Method) * 1973-08-13 1975-04-28

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58139435A (ja) * 1982-02-15 1983-08-18 Toshiba Corp ボンディング方法
JP2012169309A (ja) * 2011-02-09 2012-09-06 Ricoh Co Ltd 電子装置及びその製造方法並びに画像形成装置
US10181452B2 (en) 2017-01-27 2019-01-15 Nichia Corporation Method for manufacturing light-emitting device

Also Published As

Publication number Publication date
JPS6132814B2 (en:Method) 1986-07-29

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