JPS544828A - Method of adjusting plating thickness in automatic continuous plating and measuring device therefor - Google Patents

Method of adjusting plating thickness in automatic continuous plating and measuring device therefor

Info

Publication number
JPS544828A
JPS544828A JP7023477A JP7023477A JPS544828A JP S544828 A JPS544828 A JP S544828A JP 7023477 A JP7023477 A JP 7023477A JP 7023477 A JP7023477 A JP 7023477A JP S544828 A JPS544828 A JP S544828A
Authority
JP
Japan
Prior art keywords
plating
measuring device
device therefor
automatic continuous
adjusting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7023477A
Other languages
Japanese (ja)
Other versions
JPS6160159B2 (en
Inventor
Megumi Suda
Osamu Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON ELECTRO PLATING
Original Assignee
NIPPON ELECTRO PLATING
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON ELECTRO PLATING filed Critical NIPPON ELECTRO PLATING
Priority to JP7023477A priority Critical patent/JPS544828A/en
Publication of JPS544828A publication Critical patent/JPS544828A/en
Publication of JPS6160159B2 publication Critical patent/JPS6160159B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
JP7023477A 1977-06-14 1977-06-14 Method of adjusting plating thickness in automatic continuous plating and measuring device therefor Granted JPS544828A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7023477A JPS544828A (en) 1977-06-14 1977-06-14 Method of adjusting plating thickness in automatic continuous plating and measuring device therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7023477A JPS544828A (en) 1977-06-14 1977-06-14 Method of adjusting plating thickness in automatic continuous plating and measuring device therefor

Publications (2)

Publication Number Publication Date
JPS544828A true JPS544828A (en) 1979-01-13
JPS6160159B2 JPS6160159B2 (en) 1986-12-19

Family

ID=13425663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7023477A Granted JPS544828A (en) 1977-06-14 1977-06-14 Method of adjusting plating thickness in automatic continuous plating and measuring device therefor

Country Status (1)

Country Link
JP (1) JPS544828A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57199552A (en) * 1981-06-03 1982-12-07 Nippon Chem Ind Co Ltd:The Mold additive for casting and production thereof
JPS58100916U (en) * 1981-12-28 1983-07-09 株式会社　インタツク Snow accumulation prevention device
JPS61250192A (en) * 1985-04-25 1986-11-07 Kanai Hiroyuki Production of bead wire
JPH07173700A (en) * 1993-12-17 1995-07-11 Nec Corp Divided anode plating device and current value determining method
US9028922B2 (en) 2009-07-24 2015-05-12 Panasonic Intellectual Property Management Co., Ltd. Deposition quantity measuring apparatus, deposition quantity measuring method, and method for manufacturing electrode for electrochemical element
CN108680127A (en) * 2018-05-21 2018-10-19 北京核夕菁科技有限公司 Plating measurement method and apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS502020U (en) * 1973-05-07 1975-01-10
JPS5010256A (en) * 1973-06-04 1975-02-01
JPS5019496A (en) * 1973-06-20 1975-02-28

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS502020U (en) * 1973-05-07 1975-01-10
JPS5010256A (en) * 1973-06-04 1975-02-01
JPS5019496A (en) * 1973-06-20 1975-02-28

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57199552A (en) * 1981-06-03 1982-12-07 Nippon Chem Ind Co Ltd:The Mold additive for casting and production thereof
JPS6330101B2 (en) * 1981-06-03 1988-06-16 Nippon Chemical Ind
JPS58100916U (en) * 1981-12-28 1983-07-09 株式会社　インタツク Snow accumulation prevention device
JPS61250192A (en) * 1985-04-25 1986-11-07 Kanai Hiroyuki Production of bead wire
JPH07173700A (en) * 1993-12-17 1995-07-11 Nec Corp Divided anode plating device and current value determining method
US9028922B2 (en) 2009-07-24 2015-05-12 Panasonic Intellectual Property Management Co., Ltd. Deposition quantity measuring apparatus, deposition quantity measuring method, and method for manufacturing electrode for electrochemical element
CN108680127A (en) * 2018-05-21 2018-10-19 北京核夕菁科技有限公司 Plating measurement method and apparatus

Also Published As

Publication number Publication date
JPS6160159B2 (en) 1986-12-19

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