JPS5440568A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5440568A
JPS5440568A JP10670377A JP10670377A JPS5440568A JP S5440568 A JPS5440568 A JP S5440568A JP 10670377 A JP10670377 A JP 10670377A JP 10670377 A JP10670377 A JP 10670377A JP S5440568 A JPS5440568 A JP S5440568A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
semiconductor
adhesion
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10670377A
Other languages
Japanese (ja)
Inventor
Masao Tsuruoka
Keiichi Morita
Hideyuki Yagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10670377A priority Critical patent/JPS5440568A/en
Publication of JPS5440568A publication Critical patent/JPS5440568A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Abstract

PURPOSE: To complete the adhesion through single jig setting by previously applying an adhesive to an electrode or semiconductor of a composite material of copper-carbon fiber.
COPYRIGHT: (C)1979,JPO&Japio
JP10670377A 1977-09-07 1977-09-07 Manufacture of semiconductor device Pending JPS5440568A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10670377A JPS5440568A (en) 1977-09-07 1977-09-07 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10670377A JPS5440568A (en) 1977-09-07 1977-09-07 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5440568A true JPS5440568A (en) 1979-03-30

Family

ID=14440350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10670377A Pending JPS5440568A (en) 1977-09-07 1977-09-07 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5440568A (en)

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