JPS5436832B2 - - Google Patents
Info
- Publication number
- JPS5436832B2 JPS5436832B2 JP8832775A JP8832775A JPS5436832B2 JP S5436832 B2 JPS5436832 B2 JP S5436832B2 JP 8832775 A JP8832775 A JP 8832775A JP 8832775 A JP8832775 A JP 8832775A JP S5436832 B2 JPS5436832 B2 JP S5436832B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50088327A JPS5212571A (en) | 1975-07-21 | 1975-07-21 | Wire bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50088327A JPS5212571A (en) | 1975-07-21 | 1975-07-21 | Wire bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5212571A JPS5212571A (en) | 1977-01-31 |
| JPS5436832B2 true JPS5436832B2 (enrdf_load_html_response) | 1979-11-12 |
Family
ID=13939785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50088327A Granted JPS5212571A (en) | 1975-07-21 | 1975-07-21 | Wire bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5212571A (enrdf_load_html_response) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63257236A (ja) * | 1987-04-14 | 1988-10-25 | Mitsubishi Electric Corp | ワイヤボンデイング方法 |
-
1975
- 1975-07-21 JP JP50088327A patent/JPS5212571A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5212571A (en) | 1977-01-31 |