JPS5424913B2 - - Google Patents

Info

Publication number
JPS5424913B2
JPS5424913B2 JP14687575A JP14687575A JPS5424913B2 JP S5424913 B2 JPS5424913 B2 JP S5424913B2 JP 14687575 A JP14687575 A JP 14687575A JP 14687575 A JP14687575 A JP 14687575A JP S5424913 B2 JPS5424913 B2 JP S5424913B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14687575A
Other versions
JPS5271389A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14687575A priority Critical patent/JPS5271389A/ja
Publication of JPS5271389A publication Critical patent/JPS5271389A/ja
Publication of JPS5424913B2 publication Critical patent/JPS5424913B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/542Controlling the film thickness or evaporation rate
    • C23C14/545Controlling the film thickness or evaporation rate using measurement on deposited material
    • C23C14/547Controlling the film thickness or evaporation rate using measurement on deposited material using optical methods

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP14687575A 1975-12-11 1975-12-11 Film thicknes monitoring device of thin flm forming apparatus Granted JPS5271389A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14687575A JPS5271389A (en) 1975-12-11 1975-12-11 Film thicknes monitoring device of thin flm forming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14687575A JPS5271389A (en) 1975-12-11 1975-12-11 Film thicknes monitoring device of thin flm forming apparatus

Publications (2)

Publication Number Publication Date
JPS5271389A JPS5271389A (en) 1977-06-14
JPS5424913B2 true JPS5424913B2 (ja) 1979-08-24

Family

ID=15417530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14687575A Granted JPS5271389A (en) 1975-12-11 1975-12-11 Film thicknes monitoring device of thin flm forming apparatus

Country Status (1)

Country Link
JP (1) JPS5271389A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0647058Y2 (ja) * 1986-12-22 1994-11-30 松下電工株式会社 天井材の構造

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1980000504A1 (en) * 1978-08-18 1980-03-20 Nat Res Dev Control of deposition of thin films
EP0082654A1 (en) * 1981-12-19 1983-06-29 General Engineering Radcliffe 1979 Limited Apparatus for and a method of coating a length of material
US4943446A (en) * 1985-09-12 1990-07-24 Dennison Manufacturing Company Metallization of substrates

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0647058Y2 (ja) * 1986-12-22 1994-11-30 松下電工株式会社 天井材の構造

Also Published As

Publication number Publication date
JPS5271389A (en) 1977-06-14

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