JPS5271389A - Film thicknes monitoring device of thin flm forming apparatus - Google Patents
Film thicknes monitoring device of thin flm forming apparatusInfo
- Publication number
- JPS5271389A JPS5271389A JP14687575A JP14687575A JPS5271389A JP S5271389 A JPS5271389 A JP S5271389A JP 14687575 A JP14687575 A JP 14687575A JP 14687575 A JP14687575 A JP 14687575A JP S5271389 A JPS5271389 A JP S5271389A
- Authority
- JP
- Japan
- Prior art keywords
- forming apparatus
- monitoring device
- thin flm
- film thicknes
- thicknes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
- C23C14/547—Controlling the film thickness or evaporation rate using measurement on deposited material using optical methods
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
PURPOSE:A film thickness monitoring device of a thin film forming apparatus in which a material to be treated is separated into the material proper and monitoring portion beside it and film thickness can be monitored at the monitoring portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14687575A JPS5271389A (en) | 1975-12-11 | 1975-12-11 | Film thicknes monitoring device of thin flm forming apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14687575A JPS5271389A (en) | 1975-12-11 | 1975-12-11 | Film thicknes monitoring device of thin flm forming apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5271389A true JPS5271389A (en) | 1977-06-14 |
JPS5424913B2 JPS5424913B2 (en) | 1979-08-24 |
Family
ID=15417530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14687575A Granted JPS5271389A (en) | 1975-12-11 | 1975-12-11 | Film thicknes monitoring device of thin flm forming apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5271389A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55500588A (en) * | 1978-08-18 | 1980-09-04 | ||
EP0082654A1 (en) * | 1981-12-19 | 1983-06-29 | General Engineering Radcliffe 1979 Limited | Apparatus for and a method of coating a length of material |
EP0236310A1 (en) * | 1985-09-12 | 1987-09-16 | Dennison Manufacturing Company | Metallization of substrates |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0647058Y2 (en) * | 1986-12-22 | 1994-11-30 | 松下電工株式会社 | Ceiling material structure |
-
1975
- 1975-12-11 JP JP14687575A patent/JPS5271389A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55500588A (en) * | 1978-08-18 | 1980-09-04 | ||
EP0082654A1 (en) * | 1981-12-19 | 1983-06-29 | General Engineering Radcliffe 1979 Limited | Apparatus for and a method of coating a length of material |
EP0236310A1 (en) * | 1985-09-12 | 1987-09-16 | Dennison Manufacturing Company | Metallization of substrates |
Also Published As
Publication number | Publication date |
---|---|
JPS5424913B2 (en) | 1979-08-24 |
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