JPS5422069B2 - - Google Patents

Info

Publication number
JPS5422069B2
JPS5422069B2 JP336573A JP336573A JPS5422069B2 JP S5422069 B2 JPS5422069 B2 JP S5422069B2 JP 336573 A JP336573 A JP 336573A JP 336573 A JP336573 A JP 336573A JP S5422069 B2 JPS5422069 B2 JP S5422069B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP336573A
Other languages
Japanese (ja)
Other versions
JPS4990879A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP336573A priority Critical patent/JPS5422069B2/ja
Publication of JPS4990879A publication Critical patent/JPS4990879A/ja
Publication of JPS5422069B2 publication Critical patent/JPS5422069B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Die Bonding (AREA)
JP336573A 1972-12-28 1972-12-28 Expired JPS5422069B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP336573A JPS5422069B2 (enrdf_load_stackoverflow) 1972-12-28 1972-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP336573A JPS5422069B2 (enrdf_load_stackoverflow) 1972-12-28 1972-12-28

Publications (2)

Publication Number Publication Date
JPS4990879A JPS4990879A (enrdf_load_stackoverflow) 1974-08-30
JPS5422069B2 true JPS5422069B2 (enrdf_load_stackoverflow) 1979-08-03

Family

ID=11555305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP336573A Expired JPS5422069B2 (enrdf_load_stackoverflow) 1972-12-28 1972-12-28

Country Status (1)

Country Link
JP (1) JPS5422069B2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53128981A (en) * 1977-04-15 1978-11-10 Nec Corp Manufacture of semiconductor device
JPS559487A (en) * 1978-07-07 1980-01-23 Matsushita Electric Ind Co Ltd Method of making semiconductor device
JPS559488A (en) * 1978-07-07 1980-01-23 Matsushita Electric Ind Co Ltd Method of making semiconductor device
JPH02251150A (ja) * 1989-03-24 1990-10-08 Mitsubishi Metal Corp 半導体装置組立用Ａｕ―Ｓｉ系合金

Also Published As

Publication number Publication date
JPS4990879A (enrdf_load_stackoverflow) 1974-08-30

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