JPS4990879A - - Google Patents
Info
- Publication number
- JPS4990879A JPS4990879A JP336573A JP336573A JPS4990879A JP S4990879 A JPS4990879 A JP S4990879A JP 336573 A JP336573 A JP 336573A JP 336573 A JP336573 A JP 336573A JP S4990879 A JPS4990879 A JP S4990879A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
Landscapes
- Electrodes Of Semiconductors (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP336573A JPS5422069B2 (enrdf_load_stackoverflow) | 1972-12-28 | 1972-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP336573A JPS5422069B2 (enrdf_load_stackoverflow) | 1972-12-28 | 1972-12-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4990879A true JPS4990879A (enrdf_load_stackoverflow) | 1974-08-30 |
| JPS5422069B2 JPS5422069B2 (enrdf_load_stackoverflow) | 1979-08-03 |
Family
ID=11555305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP336573A Expired JPS5422069B2 (enrdf_load_stackoverflow) | 1972-12-28 | 1972-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5422069B2 (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53128981A (en) * | 1977-04-15 | 1978-11-10 | Nec Corp | Manufacture of semiconductor device |
| JPS559488A (en) * | 1978-07-07 | 1980-01-23 | Matsushita Electric Ind Co Ltd | Method of making semiconductor device |
| JPS559487A (en) * | 1978-07-07 | 1980-01-23 | Matsushita Electric Ind Co Ltd | Method of making semiconductor device |
| JPH02251150A (ja) * | 1989-03-24 | 1990-10-08 | Mitsubishi Metal Corp | 半導体装置組立用Ａｕ―Ｓｉ系合金 |
-
1972
- 1972-12-28 JP JP336573A patent/JPS5422069B2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53128981A (en) * | 1977-04-15 | 1978-11-10 | Nec Corp | Manufacture of semiconductor device |
| JPS559488A (en) * | 1978-07-07 | 1980-01-23 | Matsushita Electric Ind Co Ltd | Method of making semiconductor device |
| JPS559487A (en) * | 1978-07-07 | 1980-01-23 | Matsushita Electric Ind Co Ltd | Method of making semiconductor device |
| JPH02251150A (ja) * | 1989-03-24 | 1990-10-08 | Mitsubishi Metal Corp | 半導体装置組立用Ａｕ―Ｓｉ系合金 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5422069B2 (enrdf_load_stackoverflow) | 1979-08-03 |