JPS5420976A - Thin film forming device - Google Patents
Thin film forming deviceInfo
- Publication number
- JPS5420976A JPS5420976A JP8651877A JP8651877A JPS5420976A JP S5420976 A JPS5420976 A JP S5420976A JP 8651877 A JP8651877 A JP 8651877A JP 8651877 A JP8651877 A JP 8651877A JP S5420976 A JPS5420976 A JP S5420976A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- film forming
- forming device
- chamber
- small openings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
PURPOSE:To obtain a good quality thin film with little damage due to ionic impulse by dividing a vacuum vessel into a discharge chamber and a thin film forming chamber with a discharge electrode having small openings which serves as a partition wall, too, and introducing a sputtered substance in the discharge chamber into the thin film forming chamber through the small openings.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8651877A JPS5420976A (en) | 1977-07-18 | 1977-07-18 | Thin film forming device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8651877A JPS5420976A (en) | 1977-07-18 | 1977-07-18 | Thin film forming device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5420976A true JPS5420976A (en) | 1979-02-16 |
Family
ID=13889196
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8651877A Pending JPS5420976A (en) | 1977-07-18 | 1977-07-18 | Thin film forming device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5420976A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6352132A (en) * | 1986-04-10 | 1988-03-05 | Fuji Photo Film Co Ltd | Formation of solid particle film |
-
1977
- 1977-07-18 JP JP8651877A patent/JPS5420976A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6352132A (en) * | 1986-04-10 | 1988-03-05 | Fuji Photo Film Co Ltd | Formation of solid particle film |
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