JPS5420315B2 - - Google Patents
Info
- Publication number
- JPS5420315B2 JPS5420315B2 JP8094974A JP8094974A JPS5420315B2 JP S5420315 B2 JPS5420315 B2 JP S5420315B2 JP 8094974 A JP8094974 A JP 8094974A JP 8094974 A JP8094974 A JP 8094974A JP S5420315 B2 JPS5420315 B2 JP S5420315B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
- H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8094974A JPS5420315B2 (cg-RX-API-DMAC7.html) | 1974-07-15 | 1974-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8094974A JPS5420315B2 (cg-RX-API-DMAC7.html) | 1974-07-15 | 1974-07-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS519681A JPS519681A (cg-RX-API-DMAC7.html) | 1976-01-26 |
| JPS5420315B2 true JPS5420315B2 (cg-RX-API-DMAC7.html) | 1979-07-21 |
Family
ID=13732738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8094974A Expired JPS5420315B2 (cg-RX-API-DMAC7.html) | 1974-07-15 | 1974-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5420315B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5746600Y2 (cg-RX-API-DMAC7.html) * | 1977-01-31 | 1982-10-14 | ||
| JPS5651851A (en) * | 1979-10-05 | 1981-05-09 | Hitachi Ltd | Semiconductor device |
| JPS58127338A (ja) * | 1982-01-25 | 1983-07-29 | Sharp Corp | 電子部品の構造 |
| JPS60143639A (ja) * | 1983-12-29 | 1985-07-29 | Konishiroku Photo Ind Co Ltd | 集積回路装置 |
-
1974
- 1974-07-15 JP JP8094974A patent/JPS5420315B2/ja not_active Expired
Non-Patent Citations (1)
| Title |
|---|
| ELECTRONIC DESIGN=1967 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS519681A (cg-RX-API-DMAC7.html) | 1976-01-26 |