JPS54177272U - - Google Patents
Info
- Publication number
- JPS54177272U JPS54177272U JP7504478U JP7504478U JPS54177272U JP S54177272 U JPS54177272 U JP S54177272U JP 7504478 U JP7504478 U JP 7504478U JP 7504478 U JP7504478 U JP 7504478U JP S54177272 U JPS54177272 U JP S54177272U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7504478U JPS54177272U (ja) | 1978-05-31 | 1978-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7504478U JPS54177272U (ja) | 1978-05-31 | 1978-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54177272U true JPS54177272U (ja) | 1979-12-14 |
Family
ID=28989135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7504478U Pending JPS54177272U (ja) | 1978-05-31 | 1978-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54177272U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018163599A1 (ja) * | 2017-03-08 | 2018-09-13 | 三菱電機株式会社 | 半導体装置、その製造方法および半導体モジュール |
-
1978
- 1978-05-31 JP JP7504478U patent/JPS54177272U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018163599A1 (ja) * | 2017-03-08 | 2018-09-13 | 三菱電機株式会社 | 半導体装置、その製造方法および半導体モジュール |
| JP6477975B2 (ja) * | 2017-03-08 | 2019-03-06 | 三菱電機株式会社 | 半導体装置、その製造方法および半導体モジュール |
| JPWO2018163599A1 (ja) * | 2017-03-08 | 2019-03-14 | 三菱電機株式会社 | 半導体装置、その製造方法および半導体モジュール |
| JP2019091915A (ja) * | 2017-03-08 | 2019-06-13 | 三菱電機株式会社 | 半導体装置、その製造方法および半導体モジュール |