JPS54150479U - - Google Patents

Info

Publication number
JPS54150479U
JPS54150479U JP4862478U JP4862478U JPS54150479U JP S54150479 U JPS54150479 U JP S54150479U JP 4862478 U JP4862478 U JP 4862478U JP 4862478 U JP4862478 U JP 4862478U JP S54150479 U JPS54150479 U JP S54150479U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4862478U
Other languages
Japanese (ja)
Other versions
JPS5921415Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1978048624U priority Critical patent/JPS5921415Y2/ja
Publication of JPS54150479U publication Critical patent/JPS54150479U/ja
Application granted granted Critical
Publication of JPS5921415Y2 publication Critical patent/JPS5921415Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1978048624U 1978-04-10 1978-04-10 表示装置 Expired JPS5921415Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1978048624U JPS5921415Y2 (ja) 1978-04-10 1978-04-10 表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978048624U JPS5921415Y2 (ja) 1978-04-10 1978-04-10 表示装置

Publications (2)

Publication Number Publication Date
JPS54150479U true JPS54150479U (enrdf_load_stackoverflow) 1979-10-19
JPS5921415Y2 JPS5921415Y2 (ja) 1984-06-23

Family

ID=28932693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978048624U Expired JPS5921415Y2 (ja) 1978-04-10 1978-04-10 表示装置

Country Status (1)

Country Link
JP (1) JPS5921415Y2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60100788U (ja) * 1983-12-16 1985-07-09 ロ−ム株式会社 表示装置
JPH04105562U (ja) * 1991-02-20 1992-09-10 京セラ株式会社 発光素子収納用パツケージ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60100788U (ja) * 1983-12-16 1985-07-09 ロ−ム株式会社 表示装置
JPH04105562U (ja) * 1991-02-20 1992-09-10 京セラ株式会社 発光素子収納用パツケージ

Also Published As

Publication number Publication date
JPS5921415Y2 (ja) 1984-06-23

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