JPS54144500A - Heat-curable resin composition - Google Patents

Heat-curable resin composition

Info

Publication number
JPS54144500A
JPS54144500A JP5208978A JP5208978A JPS54144500A JP S54144500 A JPS54144500 A JP S54144500A JP 5208978 A JP5208978 A JP 5208978A JP 5208978 A JP5208978 A JP 5208978A JP S54144500 A JPS54144500 A JP S54144500A
Authority
JP
Japan
Prior art keywords
branched chain
straight
group
chain alkyl
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5208978A
Other languages
Japanese (ja)
Inventor
Isao Kaetsu
Minoru Kumakura
Masaru Yoshida
Goro Shimaoka
Masanobu Urabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Mitsubishi Gas Chemical Co Inc
Nippon Chemical Industrial Co Ltd
Japan Atomic Energy Agency
Original Assignee
Japan Atomic Energy Research Institute
Mitsubishi Gas Chemical Co Inc
Nippon Chemical Industrial Co Ltd
Nippon Kogaku KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Atomic Energy Research Institute, Mitsubishi Gas Chemical Co Inc, Nippon Chemical Industrial Co Ltd, Nippon Kogaku KK filed Critical Japan Atomic Energy Research Institute
Priority to JP5208978A priority Critical patent/JPS54144500A/en
Publication of JPS54144500A publication Critical patent/JPS54144500A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: A heat-curable resin composition capable of forming colorless and transparent films having improved abrasion resistance, hardness, and adhesiveness on heating, prepared by hydrolyzing a mixture of a vinyl group-containing silane, an organosilane, and a organosilicate.
CONSTITUTION: A composition prepared by hydrolyzing a mixture of (A) a vinyl group-containing silane monomer of formula I or II: (R1 is ≤6C straight or branched chain alkylene group; R2 is ≤4C straight or branched chain alkyl group; R3 is OR2, ≤4C straight or branched chain alkyl group; X is H or methyl group) or its polymer, (B) an organosilane of formula III: (R4 is ≤8C stright or branched chain alkyl group; n is an integer ≤4), and (C) an organosilicate of formula IV. Vinyltrimethoxysilane, vinyltriacetoxysilane, etc. may be cited as the silane monomer (A).
COPYRIGHT: (C)1979,JPO&Japio
JP5208978A 1978-04-29 1978-04-29 Heat-curable resin composition Pending JPS54144500A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5208978A JPS54144500A (en) 1978-04-29 1978-04-29 Heat-curable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5208978A JPS54144500A (en) 1978-04-29 1978-04-29 Heat-curable resin composition

Publications (1)

Publication Number Publication Date
JPS54144500A true JPS54144500A (en) 1979-11-10

Family

ID=12905092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5208978A Pending JPS54144500A (en) 1978-04-29 1978-04-29 Heat-curable resin composition

Country Status (1)

Country Link
JP (1) JPS54144500A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5520952A (en) * 1993-07-16 1996-05-28 Tokyo Ohka Kogyo Co., Ltd. Method for forming a protective coating film on electronic parts and devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5520952A (en) * 1993-07-16 1996-05-28 Tokyo Ohka Kogyo Co., Ltd. Method for forming a protective coating film on electronic parts and devices
US5662961A (en) * 1993-07-16 1997-09-02 Tokyo Ohka Kogyo Co., Ltd. Method for forming a protective coating film on electronic parts and devices

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