JPS54144500A - Heat-curable resin composition - Google Patents
Heat-curable resin compositionInfo
- Publication number
- JPS54144500A JPS54144500A JP5208978A JP5208978A JPS54144500A JP S54144500 A JPS54144500 A JP S54144500A JP 5208978 A JP5208978 A JP 5208978A JP 5208978 A JP5208978 A JP 5208978A JP S54144500 A JPS54144500 A JP S54144500A
- Authority
- JP
- Japan
- Prior art keywords
- branched chain
- straight
- group
- chain alkyl
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: A heat-curable resin composition capable of forming colorless and transparent films having improved abrasion resistance, hardness, and adhesiveness on heating, prepared by hydrolyzing a mixture of a vinyl group-containing silane, an organosilane, and a organosilicate.
CONSTITUTION: A composition prepared by hydrolyzing a mixture of (A) a vinyl group-containing silane monomer of formula I or II: (R1 is ≤6C straight or branched chain alkylene group; R2 is ≤4C straight or branched chain alkyl group; R3 is OR2, ≤4C straight or branched chain alkyl group; X is H or methyl group) or its polymer, (B) an organosilane of formula III: (R4 is ≤8C stright or branched chain alkyl group; n is an integer ≤4), and (C) an organosilicate of formula IV. Vinyltrimethoxysilane, vinyltriacetoxysilane, etc. may be cited as the silane monomer (A).
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5208978A JPS54144500A (en) | 1978-04-29 | 1978-04-29 | Heat-curable resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5208978A JPS54144500A (en) | 1978-04-29 | 1978-04-29 | Heat-curable resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54144500A true JPS54144500A (en) | 1979-11-10 |
Family
ID=12905092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5208978A Pending JPS54144500A (en) | 1978-04-29 | 1978-04-29 | Heat-curable resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54144500A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5520952A (en) * | 1993-07-16 | 1996-05-28 | Tokyo Ohka Kogyo Co., Ltd. | Method for forming a protective coating film on electronic parts and devices |
-
1978
- 1978-04-29 JP JP5208978A patent/JPS54144500A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5520952A (en) * | 1993-07-16 | 1996-05-28 | Tokyo Ohka Kogyo Co., Ltd. | Method for forming a protective coating film on electronic parts and devices |
US5662961A (en) * | 1993-07-16 | 1997-09-02 | Tokyo Ohka Kogyo Co., Ltd. | Method for forming a protective coating film on electronic parts and devices |
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