JPS54128272A - Structure of bonding pad - Google Patents

Structure of bonding pad

Info

Publication number
JPS54128272A
JPS54128272A JP3552378A JP3552378A JPS54128272A JP S54128272 A JPS54128272 A JP S54128272A JP 3552378 A JP3552378 A JP 3552378A JP 3552378 A JP3552378 A JP 3552378A JP S54128272 A JPS54128272 A JP S54128272A
Authority
JP
Japan
Prior art keywords
probe
pellet
pad
bonding pad
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3552378A
Other languages
Japanese (ja)
Inventor
Kenpo Sumizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3552378A priority Critical patent/JPS54128272A/en
Publication of JPS54128272A publication Critical patent/JPS54128272A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
    • H01L2224/10125—Reinforcing structures
    • H01L2224/10126—Bump collar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To prevent the probe tip from damaging the pellet and thus to ensure a quick and accurate execution of the test by forming a stage error at the ambient part approximate to the side of the function region of the bonding pad on the pellet.
CONSTITUTION: Stage error 3 is formed to function as the obstacle at the ambient part approximate to the side of the function region of bonding pad 2 formed on pellet 1. As a result, the tip of probe 4 has a shift toward the inside of the pellet from pad 2 when probe 4 of the test unit is pressed onto pad 2. Thus, probe 4 is drifted toward the function region to avoid cutting off the wiring. In this way, a quick and accurate test is ensured by fixing probe 4 onto pad 2 in an assured way.
COPYRIGHT: (C)1979,JPO&Japio
JP3552378A 1978-03-29 1978-03-29 Structure of bonding pad Pending JPS54128272A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3552378A JPS54128272A (en) 1978-03-29 1978-03-29 Structure of bonding pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3552378A JPS54128272A (en) 1978-03-29 1978-03-29 Structure of bonding pad

Publications (1)

Publication Number Publication Date
JPS54128272A true JPS54128272A (en) 1979-10-04

Family

ID=12444098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3552378A Pending JPS54128272A (en) 1978-03-29 1978-03-29 Structure of bonding pad

Country Status (1)

Country Link
JP (1) JPS54128272A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06310560A (en) * 1993-04-23 1994-11-04 Toko Inc Semiconductor device and manufacture thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06310560A (en) * 1993-04-23 1994-11-04 Toko Inc Semiconductor device and manufacture thereof

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