JPS54125138A - Plating thickness controller in one-side plating - Google Patents

Plating thickness controller in one-side plating

Info

Publication number
JPS54125138A
JPS54125138A JP3299578A JP3299578A JPS54125138A JP S54125138 A JPS54125138 A JP S54125138A JP 3299578 A JP3299578 A JP 3299578A JP 3299578 A JP3299578 A JP 3299578A JP S54125138 A JPS54125138 A JP S54125138A
Authority
JP
Japan
Prior art keywords
sheet
magnetic field
plating
hot dipping
hot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3299578A
Other languages
Japanese (ja)
Inventor
Kunihiko Karasawa
Yasuo Sato
Shoji Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Parkerizing Co Ltd
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Nihon Parkerizing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd, Nihon Parkerizing Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP3299578A priority Critical patent/JPS54125138A/en
Publication of JPS54125138A publication Critical patent/JPS54125138A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/006—Pattern or selective deposits
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
    • C23C2/24—Removing excess of molten coatings; Controlling or regulating the coating thickness using magnetic or electric fields

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)

Abstract

PURPOSE:To provide a controller by which excess molten metal deposited is scraped off to make hot dipping thickness uniform by setting a means of forming a moving magnetic field in the direction opposite to that of a metal sheet rising from a hot dipping vessel at a side of the sheet which side is not to be hot dipped. CONSTITUTION:Moving magnetic field forming unit 6 consisting of a linear motor, etc. is set above discharge side guide roller 5 of hot dipping vessel 2 at a side of metal sheet 3 to be hot dipped which side is not to be dipped. A moving magnetic field is formed in the direction opposite to that of sheet 3 rising from vessel 2 to scrape off excess molten metal deposited, thus controlling the hot dipping thickness. By setting unit 6 obliquely to sheet 3 or two small magnetic field forming units with a space between them, the thickness can be made more uniform.
JP3299578A 1978-03-24 1978-03-24 Plating thickness controller in one-side plating Pending JPS54125138A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3299578A JPS54125138A (en) 1978-03-24 1978-03-24 Plating thickness controller in one-side plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3299578A JPS54125138A (en) 1978-03-24 1978-03-24 Plating thickness controller in one-side plating

Publications (1)

Publication Number Publication Date
JPS54125138A true JPS54125138A (en) 1979-09-28

Family

ID=12374427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3299578A Pending JPS54125138A (en) 1978-03-24 1978-03-24 Plating thickness controller in one-side plating

Country Status (1)

Country Link
JP (1) JPS54125138A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1896625A1 (en) * 2005-06-30 2008-03-12 Abb Ab A device and a method for controlling thickness

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1896625A1 (en) * 2005-06-30 2008-03-12 Abb Ab A device and a method for controlling thickness
EP1896625A4 (en) * 2005-06-30 2010-07-14 Abb Ab A device and a method for controlling thickness

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