JPS54112919A - Glass bushing - Google Patents

Glass bushing

Info

Publication number
JPS54112919A
JPS54112919A JP285279A JP285279A JPS54112919A JP S54112919 A JPS54112919 A JP S54112919A JP 285279 A JP285279 A JP 285279A JP 285279 A JP285279 A JP 285279A JP S54112919 A JPS54112919 A JP S54112919A
Authority
JP
Japan
Prior art keywords
glass bushing
bushing
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP285279A
Other languages
English (en)
Inventor
Fuookuto Heruberuto
Washiru Rotaaru
Uenguraa Kurisuchian
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS54112919A publication Critical patent/JPS54112919A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Insulators (AREA)
  • Insulating Bodies (AREA)
  • Ceramic Products (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
JP285279A 1978-01-09 1979-01-09 Glass bushing Pending JPS54112919A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2800696A DE2800696C2 (de) 1978-01-09 1978-01-09 Verfahren zum Herstellen einer Durchführung

Publications (1)

Publication Number Publication Date
JPS54112919A true JPS54112919A (en) 1979-09-04

Family

ID=6029160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP285279A Pending JPS54112919A (en) 1978-01-09 1979-01-09 Glass bushing

Country Status (5)

Country Link
US (1) US4292464A (ja)
EP (1) EP0003034B1 (ja)
JP (1) JPS54112919A (ja)
BR (1) BR7900077A (ja)
DE (1) DE2800696C2 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4296275A (en) * 1980-06-09 1981-10-20 Emerson Electric Co. Hermetic refrigeration terminal
JPS594621B2 (ja) * 1981-05-18 1984-01-31 日東工器株式会社 真空二重管型太陽熱集熱管のガラス外管
US4445920A (en) * 1982-12-20 1984-05-01 The United States Of America As Represented By The Secretary Of The Navy Method of making glass-to-metal seal (header)
US4612029A (en) * 1985-07-18 1986-09-16 The United States Of America As Represented By The United States Department Of Energy Method and apparatus for performing in-situ vacuum-assisted metal to glass sealing
DE3803270A1 (de) * 1988-02-04 1989-08-17 Buehler Ag Geb Sensorkonstruktion
US4786762A (en) * 1988-03-03 1988-11-22 Emerson Electric Co. Sleeve arrangement for a hermetic terminal assembly
US4984973A (en) * 1990-03-21 1991-01-15 Tecumseh Products Company Hermetic motor compressor unit having a hermetic terminal with electrically insulating anti-tracking cap
AT401132B (de) * 1994-03-30 1996-06-25 Electrovac Formkörper und verfahren zu seiner herstellung
US6111198A (en) * 1998-06-15 2000-08-29 Olin Aegis Duplex feedthrough and method therefor
DE19907165C1 (de) * 1999-02-19 2000-10-26 Micronas Intermetall Gmbh Kupplung sowie Verfahren zu deren Herstellung
EP2371417B1 (de) * 2010-03-29 2019-07-24 BIOTRONIK SE & Co. KG Elektrische Durchführung, Verfahren zur Herstellung und Verwendung einer solchen
JP6412274B2 (ja) * 2015-08-24 2018-10-24 京セラ株式会社 電子部品搭載用パッケージおよびそれを用いた電子装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2174375A (en) * 1934-09-15 1939-09-26 Gen Electric Glass-to-metal seal
US2079354A (en) * 1935-04-24 1937-05-04 Westinghouse Electric & Mfg Co Vacuum seal
DE879739C (de) * 1943-09-01 1953-06-15 Siemens Ag Vakuumdichte Stromeinfuehrung
US2458748A (en) * 1945-05-01 1949-01-11 Stupakoff Ceramic & Mfg Compan Hermetic seal for electric terminals and the like
US2794059A (en) * 1953-03-04 1957-05-28 Gen Motors Corp Sealed tip thermocouples
DE1439128A1 (de) * 1961-08-29 1969-10-23 Siemens Ag Elektrisches Kleingeraet
DE1439099A1 (de) * 1961-08-29 1969-01-23 Siemens Ag Halbleiteranordnung
US3331913A (en) * 1965-02-08 1967-07-18 Texas Instruments Inc Ceramic-glass sealing means for encapsulation of electrical devices
US3433515A (en) * 1966-06-29 1969-03-18 Gen Motors Corp High temperature-pressure metal-to-glass seal constructions

Also Published As

Publication number Publication date
BR7900077A (pt) 1979-08-07
DE2800696C2 (de) 1985-08-22
DE2800696A1 (de) 1979-07-12
EP0003034B1 (de) 1982-02-03
US4292464A (en) 1981-09-29
EP0003034A1 (de) 1979-07-25

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