JPS54105514A - Reed mounting method of reed musical instruments - Google Patents

Reed mounting method of reed musical instruments

Info

Publication number
JPS54105514A
JPS54105514A JP1197078A JP1197078A JPS54105514A JP S54105514 A JPS54105514 A JP S54105514A JP 1197078 A JP1197078 A JP 1197078A JP 1197078 A JP1197078 A JP 1197078A JP S54105514 A JPS54105514 A JP S54105514A
Authority
JP
Japan
Prior art keywords
reed
hole
plastic resin
layer
mounting method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1197078A
Other languages
Japanese (ja)
Other versions
JPS5947317B2 (en
Inventor
Takeo Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Gakki Co Ltd
Original Assignee
Nippon Gakki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Gakki Co Ltd filed Critical Nippon Gakki Co Ltd
Priority to JP53011970A priority Critical patent/JPS5947317B2/en
Publication of JPS54105514A publication Critical patent/JPS54105514A/en
Publication of JPS5947317B2 publication Critical patent/JPS5947317B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Stringed Musical Instruments (AREA)

Abstract

PURPOSE: To maintain high accuracy and obtain workability suited for automation by forcing the reed which has been coated with a plastic resin into a reed hole, aligning both and securing these then removing the plastic resin.
CONSTITUTION: Coating is accomplished by spraying a plastic resin such as lacquer or the like on a reed and the thickness thereof is adjustabe freely overall or locally depending upon the rate of discharge of the spray. The reed 1 which has the coating layer la thereby is forced into a reed hole 3 and in this state the reed 1 is secured to a plate 2, after which the layer la is removed by dipping in a solvent such as thinner or the like, then the spacing corresponding to the thickness of the removed layer la is surely left between the lead side end and the hole 3 and the same also results even with the end of the reed 1.
COPYRIGHT: (C)1979,JPO&Japio
JP53011970A 1978-02-07 1978-02-07 How to attach a reed to a reed instrument Expired JPS5947317B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53011970A JPS5947317B2 (en) 1978-02-07 1978-02-07 How to attach a reed to a reed instrument

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53011970A JPS5947317B2 (en) 1978-02-07 1978-02-07 How to attach a reed to a reed instrument

Publications (2)

Publication Number Publication Date
JPS54105514A true JPS54105514A (en) 1979-08-18
JPS5947317B2 JPS5947317B2 (en) 1984-11-17

Family

ID=11792465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53011970A Expired JPS5947317B2 (en) 1978-02-07 1978-02-07 How to attach a reed to a reed instrument

Country Status (1)

Country Link
JP (1) JPS5947317B2 (en)

Also Published As

Publication number Publication date
JPS5947317B2 (en) 1984-11-17

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