JPS54102568A - Apparatus for dissipating heat lost form electronic construction element - Google Patents

Apparatus for dissipating heat lost form electronic construction element

Info

Publication number
JPS54102568A
JPS54102568A JP230679A JP230679A JPS54102568A JP S54102568 A JPS54102568 A JP S54102568A JP 230679 A JP230679 A JP 230679A JP 230679 A JP230679 A JP 230679A JP S54102568 A JPS54102568 A JP S54102568A
Authority
JP
Japan
Prior art keywords
dissipating heat
construction element
heat lost
form electronic
electronic construction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP230679A
Other languages
Japanese (ja)
Inventor
Rooneru Peeteru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KM Kabelmetal AG
Original Assignee
KM Kabelmetal AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KM Kabelmetal AG filed Critical KM Kabelmetal AG
Publication of JPS54102568A publication Critical patent/JPS54102568A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP230679A 1978-01-16 1979-01-16 Apparatus for dissipating heat lost form electronic construction element Pending JPS54102568A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782801660 DE2801660C2 (en) 1978-01-16 1978-01-16 Device for dissipating heat loss from electronic components

Publications (1)

Publication Number Publication Date
JPS54102568A true JPS54102568A (en) 1979-08-13

Family

ID=6029571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP230679A Pending JPS54102568A (en) 1978-01-16 1979-01-16 Apparatus for dissipating heat lost form electronic construction element

Country Status (2)

Country Link
JP (1) JPS54102568A (en)
DE (1) DE2801660C2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57140791U (en) * 1981-02-27 1982-09-03

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3016895C2 (en) * 1980-05-02 1982-10-28 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Rotating optronic and / or electronic device or system part
DE3044314C2 (en) * 1980-11-25 1986-08-14 kabelmetal electro GmbH, 3000 Hannover Housing for accommodating printed circuits equipped with heat-generating electronic components
FR2568712B1 (en) * 1984-07-31 1987-01-09 Bull Sems AIR COOLING SYSTEM FOR CABINET CONTAINING ELECTRONIC CIRCUITS
ES2024412B3 (en) * 1985-12-13 1992-03-01 Hasler Ag Ascom PROCEDURE AND DEVICE FOR THE EVACUATION OF LOST HEAT FROM AT LEAST ONE GROUP OF CONSTRUCTION OF ELECTRICAL ELEMENTS
CH670541A5 (en) * 1985-12-13 1989-06-15 Hasler Ag Ascom Lost heat removal method for module of electrical elements
DE4307902C1 (en) * 1993-03-12 1994-06-09 Bosch Gmbh Robert Cooled reception housing for automobile electronic control devices - with circulated cooling medium fed through cooling device above cooling jacket enclosing housing
DE29704885U1 (en) * 1997-03-19 1998-04-30 Siemens AG, 80333 München Arrangement for dissipating heat from a heat source arranged in a housing
DE19960840A1 (en) * 1999-12-16 2001-07-05 Siemens Ag Electronic power circuit with flat heat sink device
DE10053258A1 (en) * 2000-10-26 2002-05-16 Guenther Engineering Gmbh Heat sink for electronic device has evaporator and condenser heat exchangers connected in hermetically sealed heat sink circuit
DE10160935A1 (en) * 2001-12-12 2003-07-17 Daimler Chrysler Ag Device for motor vehicle cooling, has electrical devices to be cooled fitted in the internal area of the motor vehicle
DE102005059819A1 (en) * 2005-12-14 2007-06-21 Giga-Byte Technology Co., Ltd., Hsin-Tien Heat dissipating system for personal computer, has blower placed at outlet of computer, and heat pipe with bar, which extends to outlet, where temperature of current supply is reduced by blowing bar with blower
DE102008052112B4 (en) * 2008-10-20 2011-05-19 Bombardier Transportation Gmbh Air conditioning arrangement for a driver's cab
US10757809B1 (en) 2017-11-13 2020-08-25 Telephonics Corporation Air-cooled heat exchanger and thermal arrangement for stacked electronics
US10980151B2 (en) 2018-07-31 2021-04-13 Hewlett Packard Enterprise Development Lp Flexible heat transfer mechanism configurations
US11703921B2 (en) * 2020-03-09 2023-07-18 Nvidia Corporation Configurable heatsink

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3400543A (en) * 1966-10-31 1968-09-10 Peter G. Ross Semi-conductor cooling means
US3829740A (en) * 1973-07-09 1974-08-13 Buehler Corp Cooling arrangement for a direct current power supply
DE2417106A1 (en) * 1974-04-08 1975-10-16 Siemens Ag Gas-cooled thyristor stack has heat sinks between thyristors - and is fitted with transverse cooling fins and lateral tubes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57140791U (en) * 1981-02-27 1982-09-03

Also Published As

Publication number Publication date
DE2801660A1 (en) 1979-07-19
DE2801660C2 (en) 1986-01-30

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