JPS54101837A - Adhesive for aromtaic polyamide paper - Google Patents

Adhesive for aromtaic polyamide paper

Info

Publication number
JPS54101837A
JPS54101837A JP812078A JP812078A JPS54101837A JP S54101837 A JPS54101837 A JP S54101837A JP 812078 A JP812078 A JP 812078A JP 812078 A JP812078 A JP 812078A JP S54101837 A JPS54101837 A JP S54101837A
Authority
JP
Japan
Prior art keywords
adhesive
heat resistance
chemical resistance
high heat
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP812078A
Other languages
Japanese (ja)
Inventor
Fujio Jikou
Katsuhiko Yanagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP812078A priority Critical patent/JPS54101837A/en
Publication of JPS54101837A publication Critical patent/JPS54101837A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prepare the title adhesive having improved adhesivity to aromatic polyamide paper, while keeping the high heat resistance and chemical resistance of the base resin, by adding a specific adhesion assistant to an adhesive having excellent heat resistance and chemical resistance.
CONSTITUTION: The title adhesive composition is prepared by adding (A) about 5wt% of an adhesion assistant obtained by dissolving an unsaturating amount of LiCl2 in an amine solvent such as dimethyl formamide, to (B) an epoxy resin adhesive having high heat resistance and chemical resistance.
EFFECT: The bonded structure thus obtained has high heat resistance and chemical resistance, and useful as an insulator of various electrical appliances.
COPYRIGHT: (C)1979,JPO&Japio
JP812078A 1978-01-27 1978-01-27 Adhesive for aromtaic polyamide paper Pending JPS54101837A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP812078A JPS54101837A (en) 1978-01-27 1978-01-27 Adhesive for aromtaic polyamide paper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP812078A JPS54101837A (en) 1978-01-27 1978-01-27 Adhesive for aromtaic polyamide paper

Publications (1)

Publication Number Publication Date
JPS54101837A true JPS54101837A (en) 1979-08-10

Family

ID=11684417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP812078A Pending JPS54101837A (en) 1978-01-27 1978-01-27 Adhesive for aromtaic polyamide paper

Country Status (1)

Country Link
JP (1) JPS54101837A (en)

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