JPS5380970A - Manufacture of resin shield type semiconductor device - Google Patents
Manufacture of resin shield type semiconductor deviceInfo
- Publication number
- JPS5380970A JPS5380970A JP15649776A JP15649776A JPS5380970A JP S5380970 A JPS5380970 A JP S5380970A JP 15649776 A JP15649776 A JP 15649776A JP 15649776 A JP15649776 A JP 15649776A JP S5380970 A JPS5380970 A JP S5380970A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- manufacture
- type semiconductor
- shield type
- resin shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title abstract 2
- 229920005989 resin Polymers 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15649776A JPS5380970A (en) | 1976-12-27 | 1976-12-27 | Manufacture of resin shield type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15649776A JPS5380970A (en) | 1976-12-27 | 1976-12-27 | Manufacture of resin shield type semiconductor device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58172941A Division JPS5976456A (ja) | 1983-09-21 | 1983-09-21 | 樹脂封止型半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5380970A true JPS5380970A (en) | 1978-07-17 |
| JPS611897B2 JPS611897B2 (cs) | 1986-01-21 |
Family
ID=15629036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15649776A Granted JPS5380970A (en) | 1976-12-27 | 1976-12-27 | Manufacture of resin shield type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5380970A (cs) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55166945A (en) * | 1979-06-13 | 1980-12-26 | Nec Corp | Lead frame |
| JPH0377460U (cs) * | 1990-11-08 | 1991-08-05 | ||
| JPH0513485A (ja) * | 1991-07-03 | 1993-01-22 | Rohm Co Ltd | 電子部品の製造方法 |
-
1976
- 1976-12-27 JP JP15649776A patent/JPS5380970A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55166945A (en) * | 1979-06-13 | 1980-12-26 | Nec Corp | Lead frame |
| JPH0377460U (cs) * | 1990-11-08 | 1991-08-05 | ||
| JPH0513485A (ja) * | 1991-07-03 | 1993-01-22 | Rohm Co Ltd | 電子部品の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS611897B2 (cs) | 1986-01-21 |
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