JPS537756A - Low-pressure molding material of diallyl phthalate - Google Patents
Low-pressure molding material of diallyl phthalateInfo
- Publication number
- JPS537756A JPS537756A JP8149776A JP8149776A JPS537756A JP S537756 A JPS537756 A JP S537756A JP 8149776 A JP8149776 A JP 8149776A JP 8149776 A JP8149776 A JP 8149776A JP S537756 A JPS537756 A JP S537756A
- Authority
- JP
- Japan
- Prior art keywords
- diallyl phthalate
- low
- molding material
- pressure molding
- incorporation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8149776A JPS537756A (en) | 1976-07-10 | 1976-07-10 | Low-pressure molding material of diallyl phthalate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8149776A JPS537756A (en) | 1976-07-10 | 1976-07-10 | Low-pressure molding material of diallyl phthalate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS537756A true JPS537756A (en) | 1978-01-24 |
| JPS5439028B2 JPS5439028B2 (cs) | 1979-11-26 |
Family
ID=13748010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8149776A Granted JPS537756A (en) | 1976-07-10 | 1976-07-10 | Low-pressure molding material of diallyl phthalate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS537756A (cs) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57212225A (en) * | 1981-06-24 | 1982-12-27 | Nitto Electric Ind Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
| JPH10330626A (ja) * | 1997-06-03 | 1998-12-15 | Teijin Seiki Co Ltd | 光造形用樹脂組成物 |
| JPH10330627A (ja) * | 1997-06-03 | 1998-12-15 | Teijin Seiki Co Ltd | ダイラタンシー性を有する光硬化性樹脂組成物 |
-
1976
- 1976-07-10 JP JP8149776A patent/JPS537756A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57212225A (en) * | 1981-06-24 | 1982-12-27 | Nitto Electric Ind Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
| JPH10330626A (ja) * | 1997-06-03 | 1998-12-15 | Teijin Seiki Co Ltd | 光造形用樹脂組成物 |
| JPH10330627A (ja) * | 1997-06-03 | 1998-12-15 | Teijin Seiki Co Ltd | ダイラタンシー性を有する光硬化性樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5439028B2 (cs) | 1979-11-26 |
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