JPS5368992A - Semiconductor device and its production - Google Patents
Semiconductor device and its productionInfo
- Publication number
- JPS5368992A JPS5368992A JP14528876A JP14528876A JPS5368992A JP S5368992 A JPS5368992 A JP S5368992A JP 14528876 A JP14528876 A JP 14528876A JP 14528876 A JP14528876 A JP 14528876A JP S5368992 A JPS5368992 A JP S5368992A
- Authority
- JP
- Japan
- Prior art keywords
- side faces
- production
- semiconductor device
- sealed
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP51145288A JPS5858822B2 (ja) | 1976-12-02 | 1976-12-02 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP51145288A JPS5858822B2 (ja) | 1976-12-02 | 1976-12-02 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5368992A true JPS5368992A (en) | 1978-06-19 |
JPS5858822B2 JPS5858822B2 (ja) | 1983-12-27 |
Family
ID=15381664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51145288A Expired JPS5858822B2 (ja) | 1976-12-02 | 1976-12-02 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5858822B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7005311B2 (en) | 1993-09-30 | 2006-02-28 | Osram Gmbh | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
US7102215B2 (en) | 1997-07-29 | 2006-09-05 | Osram Gmbh | Surface-mountable light-emitting diode structural element |
-
1976
- 1976-12-02 JP JP51145288A patent/JPS5858822B2/ja not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7005311B2 (en) | 1993-09-30 | 2006-02-28 | Osram Gmbh | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
US7102212B2 (en) | 1993-09-30 | 2006-09-05 | Osram Gmbh | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
US7288831B2 (en) | 1993-09-30 | 2007-10-30 | Osram Gmbh | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
US7102215B2 (en) | 1997-07-29 | 2006-09-05 | Osram Gmbh | Surface-mountable light-emitting diode structural element |
US7183632B2 (en) | 1997-07-29 | 2007-02-27 | Osram Gmbh | Surface-mountable light-emitting diode structural element |
US7508002B2 (en) | 1997-07-29 | 2009-03-24 | Osram Gmbh | Surface-mountable light-emitting diode structural element |
Also Published As
Publication number | Publication date |
---|---|
JPS5858822B2 (ja) | 1983-12-27 |
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