JPS5366066U - - Google Patents
Info
- Publication number
- JPS5366066U JPS5366066U JP14642876U JP14642876U JPS5366066U JP S5366066 U JPS5366066 U JP S5366066U JP 14642876 U JP14642876 U JP 14642876U JP 14642876 U JP14642876 U JP 14642876U JP S5366066 U JPS5366066 U JP S5366066U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14642876U JPS5366066U (pt) | 1976-10-29 | 1976-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14642876U JPS5366066U (pt) | 1976-10-29 | 1976-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5366066U true JPS5366066U (pt) | 1978-06-03 |
Family
ID=28754919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14642876U Pending JPS5366066U (pt) | 1976-10-29 | 1976-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5366066U (pt) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58138351U (ja) * | 1982-03-12 | 1983-09-17 | 富士通株式会社 | 半導体パツケ−ジ |
| JPS61125162A (ja) * | 1984-11-22 | 1986-06-12 | Toshiba Corp | フレ−ム素材 |
| JP2001217371A (ja) * | 2000-02-03 | 2001-08-10 | Rohm Co Ltd | 樹脂パッケージ型半導体装置 |
| JP2010056372A (ja) * | 2008-08-29 | 2010-03-11 | Sanyo Electric Co Ltd | 樹脂封止型半導体装置とその製造方法 |
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1976
- 1976-10-29 JP JP14642876U patent/JPS5366066U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58138351U (ja) * | 1982-03-12 | 1983-09-17 | 富士通株式会社 | 半導体パツケ−ジ |
| JPS61125162A (ja) * | 1984-11-22 | 1986-06-12 | Toshiba Corp | フレ−ム素材 |
| JP2001217371A (ja) * | 2000-02-03 | 2001-08-10 | Rohm Co Ltd | 樹脂パッケージ型半導体装置 |
| JP2010056372A (ja) * | 2008-08-29 | 2010-03-11 | Sanyo Electric Co Ltd | 樹脂封止型半導体装置とその製造方法 |