JPS5365970A - Method of producing thick film circuit board - Google Patents

Method of producing thick film circuit board

Info

Publication number
JPS5365970A
JPS5365970A JP14119676A JP14119676A JPS5365970A JP S5365970 A JPS5365970 A JP S5365970A JP 14119676 A JP14119676 A JP 14119676A JP 14119676 A JP14119676 A JP 14119676A JP S5365970 A JPS5365970 A JP S5365970A
Authority
JP
Japan
Prior art keywords
circuit board
thick film
film circuit
producing thick
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14119676A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5751958B2 (cg-RX-API-DMAC7.html
Inventor
Takashi Isoyamada
Tamio Saitou
Yuusaku Nishi
Hiromi Matsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP14119676A priority Critical patent/JPS5365970A/ja
Publication of JPS5365970A publication Critical patent/JPS5365970A/ja
Publication of JPS5751958B2 publication Critical patent/JPS5751958B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP14119676A 1976-11-26 1976-11-26 Method of producing thick film circuit board Granted JPS5365970A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14119676A JPS5365970A (en) 1976-11-26 1976-11-26 Method of producing thick film circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14119676A JPS5365970A (en) 1976-11-26 1976-11-26 Method of producing thick film circuit board

Publications (2)

Publication Number Publication Date
JPS5365970A true JPS5365970A (en) 1978-06-12
JPS5751958B2 JPS5751958B2 (cg-RX-API-DMAC7.html) 1982-11-05

Family

ID=15286382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14119676A Granted JPS5365970A (en) 1976-11-26 1976-11-26 Method of producing thick film circuit board

Country Status (1)

Country Link
JP (1) JPS5365970A (cg-RX-API-DMAC7.html)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5485375A (en) * 1977-12-21 1979-07-06 Fujitsu Ltd Method of producing ceramic multiilayer circuit base board
JPS5533063A (en) * 1978-08-29 1980-03-08 Nippon Electric Co Method of manufacturing high packing density mounted substrate
JPS5561824U (cg-RX-API-DMAC7.html) * 1978-10-23 1980-04-26
JPS5572100A (en) * 1978-11-27 1980-05-30 Fujitsu Ltd Method of manufacturing ceramic circuit board
JPS5582406A (en) * 1978-12-14 1980-06-21 Fujitsu Ltd Method of forming thick film resistor
US5184399A (en) * 1990-06-29 1993-02-09 Kabushiki Kaisha Toshiba Method of manufacturing circuit board
WO2004008818A1 (ja) * 2002-07-10 2004-01-22 Taiyo Ink Mfg. Co., Ltd. セラミックグリーンシートへのパターン形成方法およびその形成方法に用いる導電性ペースト

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5485375A (en) * 1977-12-21 1979-07-06 Fujitsu Ltd Method of producing ceramic multiilayer circuit base board
JPS5533063A (en) * 1978-08-29 1980-03-08 Nippon Electric Co Method of manufacturing high packing density mounted substrate
JPS5561824U (cg-RX-API-DMAC7.html) * 1978-10-23 1980-04-26
JPS5572100A (en) * 1978-11-27 1980-05-30 Fujitsu Ltd Method of manufacturing ceramic circuit board
JPS5582406A (en) * 1978-12-14 1980-06-21 Fujitsu Ltd Method of forming thick film resistor
US5184399A (en) * 1990-06-29 1993-02-09 Kabushiki Kaisha Toshiba Method of manufacturing circuit board
WO2004008818A1 (ja) * 2002-07-10 2004-01-22 Taiyo Ink Mfg. Co., Ltd. セラミックグリーンシートへのパターン形成方法およびその形成方法に用いる導電性ペースト

Also Published As

Publication number Publication date
JPS5751958B2 (cg-RX-API-DMAC7.html) 1982-11-05

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