JPS5365219A - Silver solder alloy - Google Patents
Silver solder alloyInfo
- Publication number
- JPS5365219A JPS5365219A JP14151576A JP14151576A JPS5365219A JP S5365219 A JPS5365219 A JP S5365219A JP 14151576 A JP14151576 A JP 14151576A JP 14151576 A JP14151576 A JP 14151576A JP S5365219 A JPS5365219 A JP S5365219A
- Authority
- JP
- Japan
- Prior art keywords
- solder alloy
- silver solder
- silver
- alloy
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14151576A JPS596753B2 (ja) | 1976-11-25 | 1976-11-25 | 銀ろう合金 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14151576A JPS596753B2 (ja) | 1976-11-25 | 1976-11-25 | 銀ろう合金 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5365219A true JPS5365219A (en) | 1978-06-10 |
JPS596753B2 JPS596753B2 (ja) | 1984-02-14 |
Family
ID=15293748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14151576A Expired JPS596753B2 (ja) | 1976-11-25 | 1976-11-25 | 銀ろう合金 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS596753B2 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57147054U (ja) * | 1981-03-10 | 1982-09-16 | ||
JPS57147055U (ja) * | 1981-03-10 | 1982-09-16 | ||
JPS60187640A (ja) * | 1984-03-06 | 1985-09-25 | Toshiba Corp | 高融点金属−銅接合材 |
JPS63154290A (ja) * | 1986-08-29 | 1988-06-27 | Mitsubishi Steel Mfg Co Ltd | 低融点低銀ろう材 |
JPH06277872A (ja) * | 1993-03-31 | 1994-10-04 | Seikosha Co Ltd | 表面に窒化層を有する金属部材のろう付け方法とこれに用いる溶接用ろう材 |
US6596229B2 (en) * | 2000-12-29 | 2003-07-22 | United Technologies Corporation | Silver braze alloy |
CN102808104A (zh) * | 2012-09-04 | 2012-12-05 | 无锡日月合金材料有限公司 | 一种四元合金封接材料 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6647094B2 (ja) | 2016-03-16 | 2020-02-14 | 株式会社ミツトヨ | 表面性状測定機用のパートプログラム生成装置 |
-
1976
- 1976-11-25 JP JP14151576A patent/JPS596753B2/ja not_active Expired
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57147054U (ja) * | 1981-03-10 | 1982-09-16 | ||
JPS57147055U (ja) * | 1981-03-10 | 1982-09-16 | ||
JPS6224535Y2 (ja) * | 1981-03-10 | 1987-06-23 | ||
JPS6316535Y2 (ja) * | 1981-03-10 | 1988-05-11 | ||
JPS60187640A (ja) * | 1984-03-06 | 1985-09-25 | Toshiba Corp | 高融点金属−銅接合材 |
JPS63154290A (ja) * | 1986-08-29 | 1988-06-27 | Mitsubishi Steel Mfg Co Ltd | 低融点低銀ろう材 |
JPH0323277B2 (ja) * | 1986-08-29 | 1991-03-28 | Mitsubishi Steel Mfg | |
JPH06277872A (ja) * | 1993-03-31 | 1994-10-04 | Seikosha Co Ltd | 表面に窒化層を有する金属部材のろう付け方法とこれに用いる溶接用ろう材 |
US6596229B2 (en) * | 2000-12-29 | 2003-07-22 | United Technologies Corporation | Silver braze alloy |
US6936218B2 (en) * | 2000-12-29 | 2005-08-30 | United Technologies Corporation | Silver braze alloy |
CN102808104A (zh) * | 2012-09-04 | 2012-12-05 | 无锡日月合金材料有限公司 | 一种四元合金封接材料 |
Also Published As
Publication number | Publication date |
---|---|
JPS596753B2 (ja) | 1984-02-14 |
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