JPS5355912A - Pickup state detector - Google Patents
Pickup state detectorInfo
- Publication number
- JPS5355912A JPS5355912A JP13076676A JP13076676A JPS5355912A JP S5355912 A JPS5355912 A JP S5355912A JP 13076676 A JP13076676 A JP 13076676A JP 13076676 A JP13076676 A JP 13076676A JP S5355912 A JPS5355912 A JP S5355912A
- Authority
- JP
- Japan
- Prior art keywords
- state detector
- pickup state
- coordinate
- unit quantity
- pickup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13076676A JPS5355912A (en) | 1976-10-30 | 1976-10-30 | Pickup state detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13076676A JPS5355912A (en) | 1976-10-30 | 1976-10-30 | Pickup state detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5355912A true JPS5355912A (en) | 1978-05-20 |
| JPS5729846B2 JPS5729846B2 (en:Method) | 1982-06-25 |
Family
ID=15042137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13076676A Granted JPS5355912A (en) | 1976-10-30 | 1976-10-30 | Pickup state detector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5355912A (en:Method) |
-
1976
- 1976-10-30 JP JP13076676A patent/JPS5355912A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5729846B2 (en:Method) | 1982-06-25 |
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