JPS5355912A - Pickup state detector - Google Patents
Pickup state detectorInfo
- Publication number
- JPS5355912A JPS5355912A JP13076676A JP13076676A JPS5355912A JP S5355912 A JPS5355912 A JP S5355912A JP 13076676 A JP13076676 A JP 13076676A JP 13076676 A JP13076676 A JP 13076676A JP S5355912 A JPS5355912 A JP S5355912A
- Authority
- JP
- Japan
- Prior art keywords
- state detector
- pickup state
- coordinate
- unit quantity
- pickup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE: To know accurately the unit quantity for the coordinate without requesting any accuracy to the pick up operation by obtaining the coordinate unit quantity through computation based on the known length for the coordinate signal and the subject.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13076676A JPS5355912A (en) | 1976-10-30 | 1976-10-30 | Pickup state detector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13076676A JPS5355912A (en) | 1976-10-30 | 1976-10-30 | Pickup state detector |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5355912A true JPS5355912A (en) | 1978-05-20 |
JPS5729846B2 JPS5729846B2 (en) | 1982-06-25 |
Family
ID=15042137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13076676A Granted JPS5355912A (en) | 1976-10-30 | 1976-10-30 | Pickup state detector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5355912A (en) |
-
1976
- 1976-10-30 JP JP13076676A patent/JPS5355912A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5729846B2 (en) | 1982-06-25 |
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