JPS5349947A - Ultrasonic wire bonder - Google Patents

Ultrasonic wire bonder

Info

Publication number
JPS5349947A
JPS5349947A JP12380276A JP12380276A JPS5349947A JP S5349947 A JPS5349947 A JP S5349947A JP 12380276 A JP12380276 A JP 12380276A JP 12380276 A JP12380276 A JP 12380276A JP S5349947 A JPS5349947 A JP S5349947A
Authority
JP
Japan
Prior art keywords
wire bonder
ultrasonic wire
ultrasonic
junction
damper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12380276A
Other languages
Japanese (ja)
Inventor
Hisashi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12380276A priority Critical patent/JPS5349947A/en
Publication of JPS5349947A publication Critical patent/JPS5349947A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To eliminate a faulty junction due to a harmful vibration as well as to reduce the dispersion of the pressure bonding width and the tensile strength for the ultrasonic junction, by providing a vibration absorbing damper such as an oil damper, etc. to X and Y boards or the sample rotary column.
COPYRIGHT: (C)1978,JPO&Japio
JP12380276A 1976-10-18 1976-10-18 Ultrasonic wire bonder Pending JPS5349947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12380276A JPS5349947A (en) 1976-10-18 1976-10-18 Ultrasonic wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12380276A JPS5349947A (en) 1976-10-18 1976-10-18 Ultrasonic wire bonder

Publications (1)

Publication Number Publication Date
JPS5349947A true JPS5349947A (en) 1978-05-06

Family

ID=14869668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12380276A Pending JPS5349947A (en) 1976-10-18 1976-10-18 Ultrasonic wire bonder

Country Status (1)

Country Link
JP (1) JPS5349947A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040022718A (en) * 2002-09-05 2004-03-18 삼성에스디아이 주식회사 Jelly-roll type electrode assembly and secondary battery applying the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040022718A (en) * 2002-09-05 2004-03-18 삼성에스디아이 주식회사 Jelly-roll type electrode assembly and secondary battery applying the same

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