JPS534735A - Adhesive for joining metal having high melting point and conductive ceramics - Google Patents
Adhesive for joining metal having high melting point and conductive ceramicsInfo
- Publication number
- JPS534735A JPS534735A JP7891676A JP7891676A JPS534735A JP S534735 A JPS534735 A JP S534735A JP 7891676 A JP7891676 A JP 7891676A JP 7891676 A JP7891676 A JP 7891676A JP S534735 A JPS534735 A JP S534735A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- melting point
- high melting
- joining metal
- conductive ceramics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Physical Vapour Deposition (AREA)
- Non-Adjustable Resistors (AREA)
- Resistance Heating (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP51078916A JPS5855114B2 (en) | 1976-07-05 | 1976-07-05 | Bonding agent between high melting point metal and conductive ceramics |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP51078916A JPS5855114B2 (en) | 1976-07-05 | 1976-07-05 | Bonding agent between high melting point metal and conductive ceramics |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS534735A true JPS534735A (en) | 1978-01-17 |
JPS5855114B2 JPS5855114B2 (en) | 1983-12-08 |
Family
ID=13675161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51078916A Expired JPS5855114B2 (en) | 1976-07-05 | 1976-07-05 | Bonding agent between high melting point metal and conductive ceramics |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5855114B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5848915A (en) * | 1981-09-18 | 1983-03-23 | Hitachi Ltd | Semiconductor device manufacturing apparatus |
CN114315403A (en) * | 2021-12-22 | 2022-04-12 | 北京科技大学 | Wire-implanted reinforced brazing connection method for C/C and C/SiC composite material and metal |
-
1976
- 1976-07-05 JP JP51078916A patent/JPS5855114B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5848915A (en) * | 1981-09-18 | 1983-03-23 | Hitachi Ltd | Semiconductor device manufacturing apparatus |
CN114315403A (en) * | 2021-12-22 | 2022-04-12 | 北京科技大学 | Wire-implanted reinforced brazing connection method for C/C and C/SiC composite material and metal |
Also Published As
Publication number | Publication date |
---|---|
JPS5855114B2 (en) | 1983-12-08 |
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