JPS5345973A - Resin-sealing-type semiconductor device - Google Patents

Resin-sealing-type semiconductor device

Info

Publication number
JPS5345973A
JPS5345973A JP12054276A JP12054276A JPS5345973A JP S5345973 A JPS5345973 A JP S5345973A JP 12054276 A JP12054276 A JP 12054276A JP 12054276 A JP12054276 A JP 12054276A JP S5345973 A JPS5345973 A JP S5345973A
Authority
JP
Japan
Prior art keywords
sealing
resin
semiconductor device
type semiconductor
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12054276A
Other languages
English (en)
Japanese (ja)
Other versions
JPS569013B2 (cg-RX-API-DMAC7.html
Inventor
Kiyoshi Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP12054276A priority Critical patent/JPS5345973A/ja
Publication of JPS5345973A publication Critical patent/JPS5345973A/ja
Publication of JPS569013B2 publication Critical patent/JPS569013B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP12054276A 1976-10-06 1976-10-06 Resin-sealing-type semiconductor device Granted JPS5345973A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12054276A JPS5345973A (en) 1976-10-06 1976-10-06 Resin-sealing-type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12054276A JPS5345973A (en) 1976-10-06 1976-10-06 Resin-sealing-type semiconductor device

Publications (2)

Publication Number Publication Date
JPS5345973A true JPS5345973A (en) 1978-04-25
JPS569013B2 JPS569013B2 (cg-RX-API-DMAC7.html) 1981-02-26

Family

ID=14788862

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12054276A Granted JPS5345973A (en) 1976-10-06 1976-10-06 Resin-sealing-type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5345973A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5555550A (en) * 1978-10-18 1980-04-23 Nec Kyushu Ltd Semiconductor device
JPS60195878U (ja) * 1984-06-05 1985-12-27 三菱電機株式会社 エレベ−タ用冷房装置の排水装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5555550A (en) * 1978-10-18 1980-04-23 Nec Kyushu Ltd Semiconductor device
JPS60195878U (ja) * 1984-06-05 1985-12-27 三菱電機株式会社 エレベ−タ用冷房装置の排水装置

Also Published As

Publication number Publication date
JPS569013B2 (cg-RX-API-DMAC7.html) 1981-02-26

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