JPS5344670B2 - - Google Patents

Info

Publication number
JPS5344670B2
JPS5344670B2 JP11486072A JP11486072A JPS5344670B2 JP S5344670 B2 JPS5344670 B2 JP S5344670B2 JP 11486072 A JP11486072 A JP 11486072A JP 11486072 A JP11486072 A JP 11486072A JP S5344670 B2 JPS5344670 B2 JP S5344670B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11486072A
Other languages
Japanese (ja)
Other versions
JPS4861962A (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4861962A publication Critical patent/JPS4861962A/ja
Publication of JPS5344670B2 publication Critical patent/JPS5344670B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP11486072A 1971-11-17 1972-11-17 Expired JPS5344670B2 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5327371A GB1411080A (en) 1971-11-17 1971-11-17 Mounting arrangements for printed circuit boards

Publications (2)

Publication Number Publication Date
JPS4861962A JPS4861962A (enExample) 1973-08-30
JPS5344670B2 true JPS5344670B2 (enExample) 1978-11-30

Family

ID=10467218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11486072A Expired JPS5344670B2 (enExample) 1971-11-17 1972-11-17

Country Status (6)

Country Link
US (1) US3794887A (enExample)
JP (1) JPS5344670B2 (enExample)
DE (1) DE2256162C3 (enExample)
FR (1) FR2160529B1 (enExample)
GB (1) GB1411080A (enExample)
IT (1) IT974828B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4405972A (en) * 1982-03-08 1983-09-20 Burroughs Corporation Clamp device for retaining printed circuit boards under high shock conditions
JPH0412714Y2 (enExample) * 1984-10-09 1992-03-26

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3302067A (en) * 1967-01-31 Modular circuit package utilizing solder coated
GB336585A (en) * 1929-07-11 1930-10-13 Graham Amplion Ltd Improvements in elastic supports or suspensions
US2939905A (en) * 1954-03-05 1960-06-07 Earl L Canfield Electrical conductors, connections and methods of connection
DE1303083B (enExample) * 1964-05-06 Electronique Marcel Dessault Sa
GB1252256A (enExample) * 1967-11-23 1971-11-03
US3631325A (en) * 1970-06-15 1971-12-28 Sperry Rand Corp Card module and end wall treatment facilitating heat transfer and sliding
DE2211070C3 (de) * 1972-03-08 1980-08-28 Paul 8501 Oberasbach Unger Niederhalter für eine Skibindung

Also Published As

Publication number Publication date
DE2256162B2 (de) 1977-12-29
DE2256162C3 (de) 1978-08-24
FR2160529A1 (enExample) 1973-06-29
FR2160529B1 (enExample) 1975-11-21
GB1411080A (en) 1975-10-22
US3794887A (en) 1974-02-26
JPS4861962A (enExample) 1973-08-30
DE2256162A1 (de) 1973-05-24
IT974828B (it) 1974-07-10

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