JPS5341979A - Electric connector - Google Patents

Electric connector

Info

Publication number
JPS5341979A
JPS5341979A JP11522477A JP11522477A JPS5341979A JP S5341979 A JPS5341979 A JP S5341979A JP 11522477 A JP11522477 A JP 11522477A JP 11522477 A JP11522477 A JP 11522477A JP S5341979 A JPS5341979 A JP S5341979A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
chip
chip carrier
breakage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11522477A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61711B2 (cg-RX-API-DMAC10.html
Inventor
Jii Guratsube Deimiitori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of JPS5341979A publication Critical patent/JPS5341979A/ja
Publication of JPS61711B2 publication Critical patent/JPS61711B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
    • H05K7/1046—J-shaped leads
    • H10W72/5363—
    • H10W90/756—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Connecting Device With Holders (AREA)
JP11522477A 1976-09-27 1977-09-27 Electric connector Granted JPS5341979A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/727,307 US4089575A (en) 1976-09-27 1976-09-27 Connector for connecting a circuit element to the surface of a substrate

Publications (2)

Publication Number Publication Date
JPS5341979A true JPS5341979A (en) 1978-04-15
JPS61711B2 JPS61711B2 (cg-RX-API-DMAC10.html) 1986-01-10

Family

ID=24922149

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11522477A Granted JPS5341979A (en) 1976-09-27 1977-09-27 Electric connector

Country Status (8)

Country Link
US (1) US4089575A (cg-RX-API-DMAC10.html)
JP (1) JPS5341979A (cg-RX-API-DMAC10.html)
CA (1) CA1081334A (cg-RX-API-DMAC10.html)
DE (1) DE2743241A1 (cg-RX-API-DMAC10.html)
ES (1) ES462635A1 (cg-RX-API-DMAC10.html)
FR (1) FR2365899A1 (cg-RX-API-DMAC10.html)
GB (1) GB1543665A (cg-RX-API-DMAC10.html)
IT (1) IT1087366B (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6262270U (cg-RX-API-DMAC10.html) * 1985-10-04 1987-04-17
US4679871A (en) * 1985-03-22 1987-07-14 Yamaichi Electric Mfg. Co., Ltd. IC package connector
JPH02155181A (ja) * 1989-10-02 1990-06-14 Yamaichi Electric Mfg Co Ltd Ｉｃ接続器
JPH05218242A (ja) * 1982-04-19 1993-08-27 Wayne K Pfaff リードレス・チップ・キャリヤの取付装置

Families Citing this family (71)

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US4327953A (en) * 1977-06-06 1982-05-04 Texas Instruments Incorporated Interchangeable module for integrated circuits
US4222622A (en) * 1978-06-12 1980-09-16 Gte Products Corporation Electrical connector for circuit board
US4272140A (en) * 1979-12-19 1981-06-09 Gte Automatic Electric Laboratories Incorporated Arrangement for mounting dual-in-line packaged integrated circuits to thick/thin film circuits
US4351580A (en) * 1980-05-15 1982-09-28 Augat Inc. Carrier socket for leadless integrated circuit devices
US4362353A (en) * 1980-05-27 1982-12-07 Amp Incorporated Contact clip for connecting a ceramic substrate to a printed circuit board
US4352535A (en) * 1980-06-27 1982-10-05 General Motors Corporation Electrical connector
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein
US4406508A (en) * 1981-07-02 1983-09-27 Thomas & Betts Corporation Dual-in-line package assembly
US4495376A (en) * 1981-07-27 1985-01-22 Texas Instruments Incorporated Carrier for integrated circuit
JPH01132148A (ja) * 1981-07-27 1989-05-24 Texas Instr Inc <Ti> 集積回路用キャリア
DE3303165C2 (de) * 1982-02-05 1993-12-09 Hitachi Ltd Halbleitervorrichtung mit Gehäusekörper und Verbindungsleitern
US4506938A (en) * 1982-07-06 1985-03-26 At&T Bell Laboratories Integrated circuit chip carrier mounting arrangement
US4458968A (en) * 1982-07-06 1984-07-10 At&T Bell Laboratories Integrated circuit chip carrier mounting arrangement
DE3236325A1 (de) * 1982-09-30 1984-04-05 Siemens AG, 1000 Berlin und 8000 München Flachbaugruppe
FR2538961B1 (fr) * 1982-12-30 1985-07-12 Europ Composants Electron Embase pour circuit integre
SE435443B (sv) * 1983-02-18 1984-09-24 Ericsson Telefon Ab L M Kylanordning for elektroniska komponenter vilka genom hallare er anslutna till kretskort
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US4664309A (en) * 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
DE3584532D1 (de) * 1984-02-27 1991-12-05 Amp Inc Kontakt fuer schaltungstraeger und verfahren um diesen in ein gehaeuse einzusetzen.
US4555151A (en) * 1984-08-06 1985-11-26 Gte Communication Systems Corporation Contact terminal device for connecting hybrid circuit modules to a printed circuit board
US4682829A (en) * 1985-06-13 1987-07-28 Amp Incorporated Surface mount socket for dual in-line package
US4647126A (en) * 1985-06-17 1987-03-03 Sperry Corporation Compliant lead clip
US4676571A (en) * 1985-07-23 1987-06-30 Thomas & Betts Corporation Leaded chip carrier connector
JPH0325410Y2 (cg-RX-API-DMAC10.html) * 1985-08-10 1991-06-03
US4799897A (en) * 1985-12-30 1989-01-24 Dai-Ichi Seiko Kabushiki Kaisha IC tester socket
US4712721A (en) * 1986-03-17 1987-12-15 Raychem Corp. Solder delivery systems
JPH0218547Y2 (cg-RX-API-DMAC10.html) * 1986-05-02 1990-05-23
US4747017A (en) * 1986-05-27 1988-05-24 General Motors Corporation Surface mountable integrated circuit package equipped with sockets
US4873615A (en) * 1986-10-09 1989-10-10 Amp Incorporated Semiconductor chip carrier system
US4846702A (en) * 1988-01-07 1989-07-11 Minnesota Mining & Manufacturing Company Electrical connector for surface mount chip carrier installed in a socket
US4941832A (en) * 1989-01-30 1990-07-17 Amp Incorporated Low profile chip carrier socket
US5088930A (en) * 1990-11-20 1992-02-18 Advanced Interconnections Corporation Integrated circuit socket with reed-shaped leads
US5157480A (en) * 1991-02-06 1992-10-20 Motorola, Inc. Semiconductor device having dual electrical contact sites
US5177326A (en) * 1991-10-21 1993-01-05 Gec-Marconi Electronic Systems Corp. Lead wire array for a leadless chip carrier
US5158467A (en) * 1991-11-01 1992-10-27 Amp Incorporated High speed bare chip test socket
US5226825A (en) * 1992-01-15 1993-07-13 The Whitaker Corporation Surface mount chip carrier socket
US5288236A (en) * 1992-04-01 1994-02-22 Sun Microsystems, Inc. Method and apparatus for replacing electronic components on a printed circuit board
EP0567255B1 (en) * 1992-04-24 1999-01-20 Altera Corporation Surface mount chip carrier
US5880403A (en) 1994-04-01 1999-03-09 Space Electronics, Inc. Radiation shielding of three dimensional multi-chip modules
US6613978B2 (en) * 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US6261508B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US5923538A (en) * 1994-10-17 1999-07-13 Lsi Logic Corporation Support member for mounting a microelectronic circuit package
US5629837A (en) * 1995-09-20 1997-05-13 Oz Technologies, Inc. Button contact for surface mounting an IC device to a circuit board
US6046597A (en) * 1995-10-04 2000-04-04 Oz Technologies, Inc. Test socket for an IC device
FR2743170B1 (fr) * 1995-12-28 1998-02-06 Framatome Connectors Int Connecteur actif pour carte a puce
US5920114A (en) 1997-09-25 1999-07-06 International Business Machines Corporation Leadframe having resilient carrier positioning means
US5910024A (en) * 1997-08-28 1999-06-08 Mcms, Inc. Carrier socket for receiving a damaged IC
US5874323A (en) * 1997-08-28 1999-02-23 Mcms, Inc. Method of providing electrical contact to component leads
US6297654B1 (en) 1999-07-14 2001-10-02 Cerprobe Corporation Test socket and method for testing an IC device in a dead bug orientation
DE19935188C2 (de) * 1999-07-27 2002-06-13 Amphenol Tuchel Elect Kontaktblock für einen Chipkartenleser
US6368899B1 (en) * 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US6558169B2 (en) * 2001-03-29 2003-05-06 Intel Corporation Shunt power connection for an integrated circuit package
US6891276B1 (en) * 2002-01-09 2005-05-10 Bridge Semiconductor Corporation Semiconductor package device
US6575766B1 (en) * 2002-02-26 2003-06-10 Intel Corporation Laminated socket contacts
US7382043B2 (en) * 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
JP2004304604A (ja) * 2003-03-31 2004-10-28 Mitsumi Electric Co Ltd 小型カメラモジュールのソケットへの取付け構造
US7191516B2 (en) * 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices
EP2134077B1 (en) * 2004-07-12 2010-11-17 Research In Motion Limited Structure for mounting a camera unit to a circuit-board
US7918671B2 (en) * 2004-07-13 2011-04-05 Research In Motion Limited Mounting structure with springs biasing towards a latching edge
GB2416928A (en) * 2004-08-02 2006-02-08 Itt Mfg Enterprises Inc Carrier for compression chip
US20070029649A1 (en) * 2005-08-08 2007-02-08 Honeywell International Inc. Plastic lead frame with snap-together circuitry
DE102007005630B4 (de) * 2007-02-05 2019-08-08 Infineon Technologies Ag Sensorchip-Modul und Verfahren zur Herstellung eines Sensorchip-Moduls
CN201160134Y (zh) * 2007-09-22 2008-12-03 富士康(昆山)电脑接插件有限公司 电连接器
CN102007406B (zh) * 2008-03-04 2013-08-21 3M创新有限公司 利用组合光学询问方法和装置监测炸油质量
US7581965B1 (en) 2008-05-01 2009-09-01 Commscope, Inc. Of North Carolina Bottom entry interconnection element for connecting components to a circuit board
WO2010049835A1 (en) * 2008-10-27 2010-05-06 Nxp B.V. Microelectronic package assembly, method for disconnecting a microelectronic package
US10826208B1 (en) * 2017-01-30 2020-11-03 Superior Sensor Technology Sensor with integrated electrical contacts
CN111812357B (zh) * 2020-07-10 2021-05-25 浙江大学 一种用于微纳米制造的自填料三臂式热扫描探针
EP4271152A1 (de) 2022-04-27 2023-11-01 FRONIUS INTERNATIONAL GmbH Elektronische baugruppe mit zumindest einer leiterplatte und externen elektronischen bauteilen sowie wechselrichter mit einer solchen elektronischen baugruppe

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3311790A (en) * 1965-02-17 1967-03-28 Brown Engineering Company Inc Micromodule connector and assembly
US3337678A (en) * 1965-06-30 1967-08-22 John P Stelmak Sealed microminiature electronic package
US3643133A (en) * 1969-12-15 1972-02-15 Computer Ind Inc Wire-routing system
US3701077A (en) * 1969-12-29 1972-10-24 Tech Inc K Electronic components
US3710299A (en) * 1971-06-01 1973-01-09 Aries Electronics Low profile socket for integrated circuit pack
US3910664A (en) * 1973-01-04 1975-10-07 Amp Inc Multi-contact electrical connector for a ceramic substrate or the like
US3873173A (en) * 1973-10-05 1975-03-25 Itt Electrical connector assembly
US3904262A (en) * 1974-09-27 1975-09-09 John M Cutchaw Connector for leadless integrated circuit packages
US3984166A (en) * 1975-05-07 1976-10-05 Burroughs Corporation Semiconductor device package having lead frame structure with integral spring contacts
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05218242A (ja) * 1982-04-19 1993-08-27 Wayne K Pfaff リードレス・チップ・キャリヤの取付装置
US4679871A (en) * 1985-03-22 1987-07-14 Yamaichi Electric Mfg. Co., Ltd. IC package connector
JPS6262270U (cg-RX-API-DMAC10.html) * 1985-10-04 1987-04-17
JPH02155181A (ja) * 1989-10-02 1990-06-14 Yamaichi Electric Mfg Co Ltd Ｉｃ接続器

Also Published As

Publication number Publication date
JPS61711B2 (cg-RX-API-DMAC10.html) 1986-01-10
CA1081334A (en) 1980-07-08
DE2743241C2 (cg-RX-API-DMAC10.html) 1987-12-23
IT1087366B (it) 1985-06-04
US4089575A (en) 1978-05-16
GB1543665A (en) 1979-04-04
FR2365899B1 (cg-RX-API-DMAC10.html) 1982-11-19
FR2365899A1 (fr) 1978-04-21
DE2743241A1 (de) 1978-03-30
ES462635A1 (es) 1978-07-01

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