JPS5341066B2 - - Google Patents
Info
- Publication number
- JPS5341066B2 JPS5341066B2 JP10878774A JP10878774A JPS5341066B2 JP S5341066 B2 JPS5341066 B2 JP S5341066B2 JP 10878774 A JP10878774 A JP 10878774A JP 10878774 A JP10878774 A JP 10878774A JP S5341066 B2 JPS5341066 B2 JP S5341066B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10878774A JPS5341066B2 (https=) | 1974-09-24 | 1974-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10878774A JPS5341066B2 (https=) | 1974-09-24 | 1974-09-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5152277A JPS5152277A (https=) | 1976-05-08 |
| JPS5341066B2 true JPS5341066B2 (https=) | 1978-10-31 |
Family
ID=14493458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10878774A Expired JPS5341066B2 (https=) | 1974-09-24 | 1974-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5341066B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06146704A (ja) * | 1992-11-06 | 1994-05-27 | Nippon Doaachietsuku Seizo Kk | ドアクローザ |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3370207A (en) * | 1964-02-24 | 1968-02-20 | Gen Electric | Multilayer contact system for semiconductor devices including gold and copper layers |
| DE1283970B (de) * | 1966-03-19 | 1968-11-28 | Siemens Ag | Metallischer Kontakt an einem Halbleiterbauelement |
-
1974
- 1974-09-24 JP JP10878774A patent/JPS5341066B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5152277A (https=) | 1976-05-08 |