JPS5340095A - Low-shrinkable molding composition - Google Patents
Low-shrinkable molding compositionInfo
- Publication number
- JPS5340095A JPS5340095A JP11512876A JP11512876A JPS5340095A JP S5340095 A JPS5340095 A JP S5340095A JP 11512876 A JP11512876 A JP 11512876A JP 11512876 A JP11512876 A JP 11512876A JP S5340095 A JPS5340095 A JP S5340095A
- Authority
- JP
- Japan
- Prior art keywords
- low
- molding composition
- shrinkable molding
- shrinkable
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 title abstract 3
- UIFVCPMLQXKEEU-UHFFFAOYSA-N 2,3-dimethylbenzaldehyde Chemical compound CC1=CC=CC(C=O)=C1C UIFVCPMLQXKEEU-UHFFFAOYSA-N 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 239000003208 petroleum Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 239000011342 resin composition Substances 0.000 abstract 1
- 229920006337 unsaturated polyester resin Polymers 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11512876A JPS5340095A (en) | 1976-09-24 | 1976-09-24 | Low-shrinkable molding composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11512876A JPS5340095A (en) | 1976-09-24 | 1976-09-24 | Low-shrinkable molding composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5340095A true JPS5340095A (en) | 1978-04-12 |
| JPS5415911B2 JPS5415911B2 (OSRAM) | 1979-06-18 |
Family
ID=14654951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11512876A Granted JPS5340095A (en) | 1976-09-24 | 1976-09-24 | Low-shrinkable molding composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5340095A (OSRAM) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54100490A (en) * | 1978-01-25 | 1979-08-08 | Hitachi Chem Co Ltd | Electrical insulating resin composition |
| JP2008036184A (ja) * | 2006-08-08 | 2008-02-21 | Mantensha:Kk | 指圧器 |
-
1976
- 1976-09-24 JP JP11512876A patent/JPS5340095A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54100490A (en) * | 1978-01-25 | 1979-08-08 | Hitachi Chem Co Ltd | Electrical insulating resin composition |
| JP2008036184A (ja) * | 2006-08-08 | 2008-02-21 | Mantensha:Kk | 指圧器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5415911B2 (OSRAM) | 1979-06-18 |
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