JPS5335436B2 - - Google Patents

Info

Publication number
JPS5335436B2
JPS5335436B2 JP3413076A JP3413076A JPS5335436B2 JP S5335436 B2 JPS5335436 B2 JP S5335436B2 JP 3413076 A JP3413076 A JP 3413076A JP 3413076 A JP3413076 A JP 3413076A JP S5335436 B2 JPS5335436 B2 JP S5335436B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3413076A
Other languages
Japanese (ja)
Other versions
JPS51121254A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS51121254A publication Critical patent/JPS51121254A/ja
Publication of JPS5335436B2 publication Critical patent/JPS5335436B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Silicon Compounds (AREA)
JP3413076A 1975-03-28 1976-03-26 Method of removing impurities from silicon wafer Granted JPS51121254A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56310475A 1975-03-28 1975-03-28

Publications (2)

Publication Number Publication Date
JPS51121254A JPS51121254A (en) 1976-10-23
JPS5335436B2 true JPS5335436B2 (cg-RX-API-DMAC10.html) 1978-09-27

Family

ID=24249133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3413076A Granted JPS51121254A (en) 1975-03-28 1976-03-26 Method of removing impurities from silicon wafer

Country Status (3)

Country Link
JP (1) JPS51121254A (cg-RX-API-DMAC10.html)
BE (1) BE840112A (cg-RX-API-DMAC10.html)
IT (1) IT1074452B (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002020200A (ja) * 2000-07-03 2002-01-23 Sumitomo Metal Ind Ltd エピタキシャルシリコンウェーハの製造方法
WO2020130016A1 (ja) 2018-12-21 2020-06-25 サカタインクス株式会社 活性エネルギー線硬化型フレキソ印刷インキ組成物

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS546466A (en) * 1977-06-17 1979-01-18 Hitachi Ltd Surface cleaning method
JPS58146696U (ja) * 1982-03-25 1983-10-03 アロン化成株式会社 連続切断具
US5000795A (en) * 1989-06-16 1991-03-19 At&T Bell Laboratories Semiconductor wafer cleaning method and apparatus
JPH0521411A (ja) * 1991-07-12 1993-01-29 Fujitsu Ltd 表面処理方法及び表面処理装置
WO1997050019A1 (en) * 1996-06-25 1997-12-31 Cfm Technologies, Inc. Improved method for sulfuric acid resist stripping

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002020200A (ja) * 2000-07-03 2002-01-23 Sumitomo Metal Ind Ltd エピタキシャルシリコンウェーハの製造方法
WO2020130016A1 (ja) 2018-12-21 2020-06-25 サカタインクス株式会社 活性エネルギー線硬化型フレキソ印刷インキ組成物

Also Published As

Publication number Publication date
JPS51121254A (en) 1976-10-23
BE840112A (fr) 1976-07-16
IT1074452B (it) 1985-04-20

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