JPS533326B1 - - Google Patents
Info
- Publication number
- JPS533326B1 JPS533326B1 JP6145672A JP6145672A JPS533326B1 JP S533326 B1 JPS533326 B1 JP S533326B1 JP 6145672 A JP6145672 A JP 6145672A JP 6145672 A JP6145672 A JP 6145672A JP S533326 B1 JPS533326 B1 JP S533326B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/936—Chemical deposition, e.g. electroless plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12736—Al-base component
- Y10T428/1275—Next to Group VIII or IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16008771A | 1971-07-06 | 1971-07-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS533326B1 true JPS533326B1 (ja) | 1978-02-06 |
Family
ID=22575461
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6145672A Pending JPS533326B1 (ja) | 1971-07-06 | 1972-06-21 |
Country Status (5)
Country | Link |
---|---|
US (1) | US3782978A (ja) |
JP (1) | JPS533326B1 (ja) |
FR (1) | FR2144782B1 (ja) |
GB (1) | GB1344760A (ja) |
IT (1) | IT956096B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005126734A (ja) * | 2003-10-21 | 2005-05-19 | C Uyemura & Co Ltd | 無電解ニッケルめっき浴及びそれを用いためっき方法 |
JP2005302137A (ja) * | 2004-04-09 | 2005-10-27 | Fuji Electric Device Technology Co Ltd | 磁気記録媒体用基板およびその製造方法 |
JP2008274444A (ja) * | 2008-08-21 | 2008-11-13 | C Uyemura & Co Ltd | 無電解ニッケルめっき浴及びそれを用いためっき方法 |
JPWO2007043333A1 (ja) * | 2005-10-07 | 2009-04-16 | 日鉱金属株式会社 | 無電解ニッケルめっき液 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4113248A (en) * | 1976-05-07 | 1978-09-12 | Aikoh Co., Ltd. | Baseball bat made of light alloy |
JPS52156173U (ja) * | 1976-05-19 | 1977-11-26 | ||
US4092025A (en) * | 1976-05-19 | 1978-05-30 | Aikoh Co., Ltd. | Baseball bat made of fiber-reinforced plastics |
US5300330A (en) * | 1981-04-01 | 1994-04-05 | Surface Technology, Inc. | Stabilized composite electroless plating compositions |
US5145517A (en) * | 1981-04-01 | 1992-09-08 | Surface Technology, Inc. | Composite electroless plating-solutions, processes, and articles thereof |
CA1185404A (en) * | 1981-07-27 | 1985-04-16 | Glenn O. Mallory | Electroless plating with reduced tensile stress |
US4600609A (en) * | 1985-05-03 | 1986-07-15 | Macdermid, Incorporated | Method and composition for electroless nickel deposition |
US4780342A (en) * | 1987-07-20 | 1988-10-25 | General Electric Company | Electroless nickel plating composition and method for its preparation and use |
US5017410A (en) * | 1988-05-23 | 1991-05-21 | United Technologies Corporation | Wear resistant electroless nickel-boron coating compositions |
US4983428A (en) * | 1988-06-09 | 1991-01-08 | United Technologies Corporation | Ethylenethiourea wear resistant electroless nickel-boron coating compositions |
US4954370A (en) * | 1988-12-21 | 1990-09-04 | International Business Machines Corporation | Electroless plating of nickel on anodized aluminum |
TW390915B (en) * | 1995-10-23 | 2000-05-21 | Uyemura C & Co Ltd | Electroless nickel plating solution and method |
DE19655326B4 (de) * | 1995-10-23 | 2005-07-28 | C. Uyemura & Co., Ltd. | Verfahren zum außenstromlosen Dickvergolden |
US6183546B1 (en) | 1998-11-02 | 2001-02-06 | Mccomas Industries International | Coating compositions containing nickel and boron |
CN1056422C (zh) * | 1998-12-24 | 2000-09-13 | 冶金工业部钢铁研究总院 | 一种化学镀镍光亮剂 |
US20090090440A1 (en) * | 2007-10-04 | 2009-04-09 | Ensign-Bickford Aerospace & Defense Company | Exothermic alloying bimetallic particles |
US9579639B2 (en) * | 2013-09-05 | 2017-02-28 | Saudi Arabian Oil Company | Tethered transition metals promoted photocatalytic system for efficient hydrogen evolutions |
CN111235558B (zh) * | 2020-03-20 | 2021-11-05 | 玉环市环宇光学仪器股份有限公司 | 耐磨耐腐蚀铝基复合材料及其制备方法 |
-
1971
- 1971-07-06 US US00160087A patent/US3782978A/en not_active Expired - Lifetime
-
1972
- 1972-05-31 IT IT25185/72A patent/IT956096B/it active
- 1972-06-21 JP JP6145672A patent/JPS533326B1/ja active Pending
- 1972-07-05 FR FR7224271A patent/FR2144782B1/fr not_active Expired
- 1972-07-06 GB GB3170672A patent/GB1344760A/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005126734A (ja) * | 2003-10-21 | 2005-05-19 | C Uyemura & Co Ltd | 無電解ニッケルめっき浴及びそれを用いためっき方法 |
JP2005302137A (ja) * | 2004-04-09 | 2005-10-27 | Fuji Electric Device Technology Co Ltd | 磁気記録媒体用基板およびその製造方法 |
JPWO2007043333A1 (ja) * | 2005-10-07 | 2009-04-16 | 日鉱金属株式会社 | 無電解ニッケルめっき液 |
JP4536781B2 (ja) * | 2005-10-07 | 2010-09-01 | 日鉱金属株式会社 | 無電解ニッケルめっき液 |
JP2008274444A (ja) * | 2008-08-21 | 2008-11-13 | C Uyemura & Co Ltd | 無電解ニッケルめっき浴及びそれを用いためっき方法 |
Also Published As
Publication number | Publication date |
---|---|
FR2144782B1 (ja) | 1974-12-27 |
DE2233276A1 (de) | 1973-01-18 |
DE2233276B2 (de) | 1975-11-13 |
US3782978A (en) | 1974-01-01 |
FR2144782A1 (ja) | 1973-02-16 |
IT956096B (it) | 1973-10-10 |
GB1344760A (en) | 1974-01-23 |