JPS5330435A - Etching liquid - Google Patents

Etching liquid

Info

Publication number
JPS5330435A
JPS5330435A JP10525576A JP10525576A JPS5330435A JP S5330435 A JPS5330435 A JP S5330435A JP 10525576 A JP10525576 A JP 10525576A JP 10525576 A JP10525576 A JP 10525576A JP S5330435 A JPS5330435 A JP S5330435A
Authority
JP
Japan
Prior art keywords
etching liquid
etching
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10525576A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5641700B2 (US07714131-20100511-C00038.png
Inventor
Manji Fukuda
Masami Unno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP10525576A priority Critical patent/JPS5330435A/ja
Publication of JPS5330435A publication Critical patent/JPS5330435A/ja
Publication of JPS5641700B2 publication Critical patent/JPS5641700B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/28—Acidic compositions for etching iron group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
JP10525576A 1976-09-02 1976-09-02 Etching liquid Granted JPS5330435A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10525576A JPS5330435A (en) 1976-09-02 1976-09-02 Etching liquid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10525576A JPS5330435A (en) 1976-09-02 1976-09-02 Etching liquid

Publications (2)

Publication Number Publication Date
JPS5330435A true JPS5330435A (en) 1978-03-22
JPS5641700B2 JPS5641700B2 (US07714131-20100511-C00038.png) 1981-09-30

Family

ID=14402533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10525576A Granted JPS5330435A (en) 1976-09-02 1976-09-02 Etching liquid

Country Status (1)

Country Link
JP (1) JPS5330435A (US07714131-20100511-C00038.png)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0757118B1 (en) * 1995-08-01 2001-04-04 MEC CO., Ltd. Method for microetching copper or copper alloy
EP1490530A4 (en) * 2002-03-05 2005-04-13 Rd Chemical Co METHODS AND COMPOSITIONS FOR PRODUCING OXIDE ON COPPER
EP1780309A1 (en) * 2005-10-25 2007-05-02 Atotech Deutschland Gmbh Composition and method for improved adhesion of polymeric materials to copper or copper alloy surfaces
WO2009091012A1 (ja) 2008-01-15 2009-07-23 Mitsubishi Paper Mills Limited 銅または銅合金用のエッチング液、エッチング前処理液およびエッチング方法
EP2241653A1 (en) * 2009-04-15 2010-10-20 ATOTECH Deutschland GmbH Composition and method for micro etching of copper and copper alloys

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0757118B1 (en) * 1995-08-01 2001-04-04 MEC CO., Ltd. Method for microetching copper or copper alloy
EP1490530A4 (en) * 2002-03-05 2005-04-13 Rd Chemical Co METHODS AND COMPOSITIONS FOR PRODUCING OXIDE ON COPPER
EP1780309A1 (en) * 2005-10-25 2007-05-02 Atotech Deutschland Gmbh Composition and method for improved adhesion of polymeric materials to copper or copper alloy surfaces
WO2007048559A1 (en) * 2005-10-25 2007-05-03 Atotech Deutschland Gmbh Composition and method for improved adhesion of polymeric materials to copper or copper alloy surfaces
US8192636B2 (en) 2005-10-25 2012-06-05 Atotech Deutschland Gmbh Composition and method for improved adhesion of polymeric materials to copper alloy surfaces
WO2009091012A1 (ja) 2008-01-15 2009-07-23 Mitsubishi Paper Mills Limited 銅または銅合金用のエッチング液、エッチング前処理液およびエッチング方法
EP2241653A1 (en) * 2009-04-15 2010-10-20 ATOTECH Deutschland GmbH Composition and method for micro etching of copper and copper alloys

Also Published As

Publication number Publication date
JPS5641700B2 (US07714131-20100511-C00038.png) 1981-09-30

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