JPS52108351A - Etching liquid - Google Patents
Etching liquidInfo
- Publication number
- JPS52108351A JPS52108351A JP2507076A JP2507076A JPS52108351A JP S52108351 A JPS52108351 A JP S52108351A JP 2507076 A JP2507076 A JP 2507076A JP 2507076 A JP2507076 A JP 2507076A JP S52108351 A JPS52108351 A JP S52108351A
- Authority
- JP
- Japan
- Prior art keywords
- etching liquid
- etching
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2507076A JPS6038022B2 (en) | 1976-03-10 | 1976-03-10 | etching liquid |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2507076A JPS6038022B2 (en) | 1976-03-10 | 1976-03-10 | etching liquid |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52108351A true JPS52108351A (en) | 1977-09-10 |
JPS6038022B2 JPS6038022B2 (en) | 1985-08-29 |
Family
ID=12155653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2507076A Expired JPS6038022B2 (en) | 1976-03-10 | 1976-03-10 | etching liquid |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6038022B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6043831A (en) * | 1983-08-22 | 1985-03-08 | Nippon Telegr & Teleph Corp <Ntt> | Etchant for manufacture of semiconductor device |
US7312159B2 (en) | 2000-08-31 | 2007-12-25 | Micron Technology, Inc. | Compositions for dissolution of low-k dielectric films, and methods of use |
US9193904B2 (en) | 2011-08-31 | 2015-11-24 | Hayashi Pure Chemical Ind., Ltd. | Etchant composition and etching method |
CN113061438A (en) * | 2021-03-23 | 2021-07-02 | 泰晶科技股份有限公司 | Organic etching liquid and etching method for AT cut quartz wafer |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999038040A1 (en) * | 1998-01-22 | 1999-07-29 | Dai Nippon Printing Co., Ltd. | Phase mask for manufacturing diffraction grating, and method of manufacture |
-
1976
- 1976-03-10 JP JP2507076A patent/JPS6038022B2/en not_active Expired
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6043831A (en) * | 1983-08-22 | 1985-03-08 | Nippon Telegr & Teleph Corp <Ntt> | Etchant for manufacture of semiconductor device |
US7312159B2 (en) | 2000-08-31 | 2007-12-25 | Micron Technology, Inc. | Compositions for dissolution of low-k dielectric films, and methods of use |
US7399424B2 (en) | 2000-08-31 | 2008-07-15 | Micron Technology, Inc. | Compositions for dissolution of low-k dielectric films, and methods of use |
US7432214B2 (en) | 2000-08-31 | 2008-10-07 | Micron Technology, Inc. | Compositions for dissolution of low-k dielectric film, and methods of use |
US7521373B2 (en) | 2000-08-31 | 2009-04-21 | Micron Technology, Inc. | Compositions for dissolution of low-k dielectric films, and methods of use |
US8142673B2 (en) * | 2000-08-31 | 2012-03-27 | Micron Technology, Inc. | Compositions for dissolution of low-k dielectric films, and methods of use |
US8632692B2 (en) | 2000-08-31 | 2014-01-21 | Micron Technology, Inc. | Compositions for use in semiconductor devices |
US8951433B2 (en) | 2000-08-31 | 2015-02-10 | Micron Technology, Inc. | Compositions for use in semiconductor devices |
US9193904B2 (en) | 2011-08-31 | 2015-11-24 | Hayashi Pure Chemical Ind., Ltd. | Etchant composition and etching method |
CN113061438A (en) * | 2021-03-23 | 2021-07-02 | 泰晶科技股份有限公司 | Organic etching liquid and etching method for AT cut quartz wafer |
CN113061438B (en) * | 2021-03-23 | 2022-05-17 | 泰晶科技股份有限公司 | Organic etching liquid and etching method for AT-cut quartz wafer |
Also Published As
Publication number | Publication date |
---|---|
JPS6038022B2 (en) | 1985-08-29 |
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