JPS52108351A - Etching liquid - Google Patents

Etching liquid

Info

Publication number
JPS52108351A
JPS52108351A JP2507076A JP2507076A JPS52108351A JP S52108351 A JPS52108351 A JP S52108351A JP 2507076 A JP2507076 A JP 2507076A JP 2507076 A JP2507076 A JP 2507076A JP S52108351 A JPS52108351 A JP S52108351A
Authority
JP
Japan
Prior art keywords
etching liquid
etching
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2507076A
Other languages
Japanese (ja)
Other versions
JPS6038022B2 (en
Inventor
Masanobu Kaen
Tsuyoshi Tamura
Osamu Asai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2507076A priority Critical patent/JPS6038022B2/en
Publication of JPS52108351A publication Critical patent/JPS52108351A/en
Publication of JPS6038022B2 publication Critical patent/JPS6038022B2/en
Expired legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
JP2507076A 1976-03-10 1976-03-10 etching liquid Expired JPS6038022B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2507076A JPS6038022B2 (en) 1976-03-10 1976-03-10 etching liquid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2507076A JPS6038022B2 (en) 1976-03-10 1976-03-10 etching liquid

Publications (2)

Publication Number Publication Date
JPS52108351A true JPS52108351A (en) 1977-09-10
JPS6038022B2 JPS6038022B2 (en) 1985-08-29

Family

ID=12155653

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2507076A Expired JPS6038022B2 (en) 1976-03-10 1976-03-10 etching liquid

Country Status (1)

Country Link
JP (1) JPS6038022B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6043831A (en) * 1983-08-22 1985-03-08 Nippon Telegr & Teleph Corp <Ntt> Etchant for manufacture of semiconductor device
US7312159B2 (en) 2000-08-31 2007-12-25 Micron Technology, Inc. Compositions for dissolution of low-k dielectric films, and methods of use
US9193904B2 (en) 2011-08-31 2015-11-24 Hayashi Pure Chemical Ind., Ltd. Etchant composition and etching method
CN113061438A (en) * 2021-03-23 2021-07-02 泰晶科技股份有限公司 Organic etching liquid and etching method for AT cut quartz wafer

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999038040A1 (en) * 1998-01-22 1999-07-29 Dai Nippon Printing Co., Ltd. Phase mask for manufacturing diffraction grating, and method of manufacture

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6043831A (en) * 1983-08-22 1985-03-08 Nippon Telegr & Teleph Corp <Ntt> Etchant for manufacture of semiconductor device
US7312159B2 (en) 2000-08-31 2007-12-25 Micron Technology, Inc. Compositions for dissolution of low-k dielectric films, and methods of use
US7399424B2 (en) 2000-08-31 2008-07-15 Micron Technology, Inc. Compositions for dissolution of low-k dielectric films, and methods of use
US7432214B2 (en) 2000-08-31 2008-10-07 Micron Technology, Inc. Compositions for dissolution of low-k dielectric film, and methods of use
US7521373B2 (en) 2000-08-31 2009-04-21 Micron Technology, Inc. Compositions for dissolution of low-k dielectric films, and methods of use
US8142673B2 (en) * 2000-08-31 2012-03-27 Micron Technology, Inc. Compositions for dissolution of low-k dielectric films, and methods of use
US8632692B2 (en) 2000-08-31 2014-01-21 Micron Technology, Inc. Compositions for use in semiconductor devices
US8951433B2 (en) 2000-08-31 2015-02-10 Micron Technology, Inc. Compositions for use in semiconductor devices
US9193904B2 (en) 2011-08-31 2015-11-24 Hayashi Pure Chemical Ind., Ltd. Etchant composition and etching method
CN113061438A (en) * 2021-03-23 2021-07-02 泰晶科技股份有限公司 Organic etching liquid and etching method for AT cut quartz wafer
CN113061438B (en) * 2021-03-23 2022-05-17 泰晶科技股份有限公司 Organic etching liquid and etching method for AT-cut quartz wafer

Also Published As

Publication number Publication date
JPS6038022B2 (en) 1985-08-29

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